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Among resistive random access memory (RRAM) architectures, one transistor one memristor (1T1R) crossbar is the most fledged one. For 1T1R crossbar, a logic operation-based Design for Testability and parallel test algorithm, which is an improvement of March C*-1T1R test algorithm, are proposed. The pass-fail fault dictionary of the proposed test algorithm is analysed. Analytical results show that the proposed test algorithm can detect all the modelled faults caused by the parametric variation of memristors and traditional RAM. Compared with March MOM, March C* and March C*-1T1R, the test time of the proposed test algorithm is reduced with a little area overhead for a large size crossbar.
This Letter proposes a new scheme to eliminate the bit-line leakage current of static random access memory. The proposed scheme utilises a four-input sense amplifier to amplify the voltages of self-compared bit-line pairs. The bit-lines of the proposed structure have no series capacitances and are directly connected to the sense amplifier input. By this way, read delay and error caused by the leakage current of bit-lines will be eliminated. Simulation results in SMIC 28 nm CMOS process design kits show that the proposed scheme has better stability and can decrease delay time by 41.1% at 0.9 V supply voltage compared with the X-Calibration technology.
MgAl2O4 (MAO)-based magnetic tunnel junctions (MTJs) with an MAO thickness of ∼1.25 nm are fabricated and their cycling characteristics under dynamic voltage stress are evaluated. The speed of breakdown strongly depended on the pulse polarities used, bipolar, positive (+) unipolar, and negative (−) unipolar. The bipolar condition yielded more rapid breakdown under cycling. Between the two unipolar conditions, positive bias yielded more rapid breakdown than negative bias; the difference between these is understood to arise from the conditions of the interface between the MAO and ferromagnetic layers. Among apparently normal MTJ cells showing little resistance drift, 20% were degraded during a long cycling test in the bipolar stress condition. Thus, the use of bipolar voltage stress is essential to screen for potentially defective MTJs, and the asymmetric condition at the interface is minimised by process control for application of the simple unipolar bias condition.
Fin field-effect transistors (FinFETs) are replacing the traditional planar metal–oxide–semiconductor FETs (MOSFETs) because of superior capability in controlling short channel effects, leakage current, propagation delay, and power dissipation. Planar MOSFETs face the problem of process variability but the FinFETs mitigate the device-performance variability due to number of dopant ions. This work includes the design of static-random access memory (SRAM) cell using FinFETs. The performance analysis of the ST11T, proposed ST13T SRAM cell, and with power gating sleep transistors is given in this study using the Cadence Virtuoso Tool (V.6.1). Owing to its improved gate controllability and scalability, the FinFET transistor structure is better than the conventional planar complementary MOS technology. The proposed design aims at the power reduction and speed improvement for the SRAM cell. From the result it is clear that optimised proposed FinFET-based ST13T SRAM cell is 92% more power efficient with the use of power gating technique, i.e. sleep transistors approach and having 12.84% less delay due to the use of transmission gates in the access path.
A new pathway to design floating gate quantum dot (QD) non-volatile RAM (QDNVRAM) cells that possess high-speed low-voltage Erase capabilities not possible with conventional floating gate NV memories is presented. This is achieved by directly accessing the QD floating gate layer with an additional drain (D2) during the Erase operation. Experimental data on fabricated long-channel (10 μm/14 μm) QDNVRAM cell shows ‘Erase’ pulse duration of ∼4 μs at voltage of about 10 V using drain D2 which is over two-order smaller than the ‘Write’ pulse value. Quantum mechanical simulations are also presented. QDNVRAM fabrication process is compatible with CMOS processing.
Soft errors in semiconductor memories occur due to charged particle strikes on sensitive nodes. Technology and voltage scaling increased dramatically the susceptibility of static random access memories (SRAMs) to soft errors. In this study, the authors present AS8-SRAM, a new asymmetric memory cell that enhances the soft error resilience of SRAMs by increasing the cells critical charge. They run Simulation Program with Integrated Circuit Emphasissimulations and system level experiments to validate the AS8-SRAM cell characteristics at circuit level and evaluate the energy and reliability effectiveness of an AS8-SRAM-based cache memory. The authors’ results show that AS8-SRAM presents up to 58 times less failures in time compared to six-transistor SRAM. Moreover, based on embedded benchmarks experimentations, AS8-SRAM achieves up to 22% reduction in energy-delay product without any considerable loss in performance.
In most embedded microprocessor based System on chips (SoCs), cache has become a major source of power consumption due to its increasing size and high access rate. Power optimization of cache based on Compare-based adaptive clock gating (CACG) is proposed to reduce the power waste due to cache idle. By detecting the cache's working state, the CACG can automatically turn off its clock when it is in idle state, saving a large percentage of dynamic power. Measurements of a real SoC chip fabricated under TSMC 65nm CMOS process show that an average of 30.3% power reduction is gained in Dhrystone test benchmark at a cost of negligible area overhead and no virtually performance loss.
