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Online ISSN 1751-861X Print ISSN 1751-8601

IET Computers & Digital Techniques

Volume 5, Issue 3, May 2011

Volume 5, Issue 3

May 2011

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    • Editorial: Three-dimensional integrated circuits design
      Integration schemes and enabling technologies for three-dimensional integrated circuits
      Thermal–electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
      Three-dimensional integrated circuits implementation of multiple applications emphasising manufacture reuse
      Test-wrapper optimisation for embedded cores in through-silicon via-based three-dimensional system on chips
      Reconfigurable five-layer three-dimensional integrated memory-on-logic synthetic aperture radar processor
      Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration
      Stacking magnetic random access memory atop microprocessors: an architecture-level evaluation

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