Electronics & Power
Volume 26, Issue 9, September 1980
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Volume 26, Issue 9
September 1980
No trade, free trade or fair trade?
- Source: Electronics & Power, Volume 26, Issue 9, page: 687 –687
- DOI: 10.1049/ep.1980.0353
- Type: Article
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British Aerospace top dogs at this year's air show
- Author(s): Steve Rogerson
- Source: Electronics & Power, Volume 26, Issue 9, page: 688 –688
- DOI: 10.1049/ep.1980.0354
- Type: Article
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Farnborough International 80
- Source: Electronics & Power, Volume 26, Issue 9, page: 689 –689
- DOI: 10.1049/ep.1980.0355
- Type: Article
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689
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Double package at Brighton
- Source: Electronics & Power, Volume 26, Issue 9, page: 689 –689
- DOI: 10.1049/ep.1980.0356
- Type: Article
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BP takes Faraday on tour
- Source: Electronics & Power, Volume 26, Issue 9, page: 690 –690
- DOI: 10.1049/ep.1980.0357
- Type: Article
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690
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Innovative design in first Inmos product
- Author(s): D. Moralee
- Source: Electronics & Power, Volume 26, Issue 9, page: 690 –690
- DOI: 10.1049/ep.1980.0358
- Type: Article
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No bovver in phone booths
- Source: Electronics & Power, Volume 26, Issue 9, page: 691 –691
- DOI: 10.1049/ep.1980.0359
- Type: Article
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691
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Water charges rise 200% in 6 years
- Source: Electronics & Power, Volume 26, Issue 9, page: 691 –691
- DOI: 10.1049/ep.1980.0360
- Type: Article
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Theatre bookings by computer
- Source: Electronics & Power, Volume 26, Issue 9, page: 692 –692
- DOI: 10.1049/ep.1980.0361
- Type: Article
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692
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Sun shines on Europe
- Source: Electronics & Power, Volume 26, Issue 9, page: 692 –692
- DOI: 10.1049/ep.1980.0362
- Type: Article
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Management tonic for health & safety
- Source: Electronics & Power, Volume 26, Issue 9, page: 692 –692
- DOI: 10.1049/ep.1980.0363
- Type: Article
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692
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Seminex call for papers
- Source: Electronics & Power, Volume 26, Issue 9, page: 692 –692
- DOI: 10.1049/ep.1980.0364
- Type: Article
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HRH Prince of Wales to present Girl Tech. Eng. Award
- Source: Electronics & Power, Volume 26, Issue 9, page: 692 –692
- DOI: 10.1049/ep.1980.0365
- Type: Article
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Energy control
- Author(s): H. Goodenough
- Source: Electronics & Power, Volume 26, Issue 9, page: 693 –693
- DOI: 10.1049/ep.1980.0366
- Type: Article
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693
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Autowagon rides again?
- Author(s): J. Hopkinson
- Source: Electronics & Power, Volume 26, Issue 9, page: 693 –693
- DOI: 10.1049/ep.1980.0367
- Type: Article
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Misconceptions on micro-computers
- Author(s): R.S. Mellor
- Source: Electronics & Power, Volume 26, Issue 9, page: 693 –693
- DOI: 10.1049/ep.1980.0368
- Type: Article
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Live effect again
- Author(s): S.F. Benham
- Source: Electronics & Power, Volume 26, Issue 9, page: 693 –693
- DOI: 10.1049/ep.1980.0369
- Type: Article
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Conservation given top billing in US energy programme
- Author(s): Lewis Holmes
- Source: Electronics & Power, Volume 26, Issue 9, p. 696 –698
- DOI: 10.1049/ep.1980.0370
- Type: Article
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Nuclear energy and solar technology get all the headlines, but energy conservation may win the struggle to reduce US dependence on foreign oil. Although a buildup of electrical supply is part of that struggle, the power-generating industry is in trouble and finding it difficult to respond to the needs of the US energy programme
Engineering with words
- Author(s): Dennis Moralee
- Source: Electronics & Power, Volume 26, Issue 9, p. 699 –703
- DOI: 10.1049/ep.1980.0371
- Type: Article
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Why is the emergence of software engineering so important, and what is the relationship between software production and the established brances of the engineering profession?
Limits to the size of semiconductor devices
- Author(s): B.L.H. Wilson
- Source: Electronics & Power, Volume 26, Issue 9, p. 704 –708
- DOI: 10.1049/ep.1980.0372
- Type: Article
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Component density on integrated circuits continues to increase at a high rate. What are the limitations to miniaturisation of components, and by what means are these limits pushed back?
Thick-film circuits for high-reliability applications
- Author(s): J. Hodgkinson
- Source: Electronics & Power, Volume 26, Issue 9, p. 709 –711
- DOI: 10.1049/ep.1980.0373
- Type: Article
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The microminiaturisation of electronic circuitry offers not only small size, but also, and more importantly, increased ruggedness and reliability. With thick-film hybrid-circuit technology, large numbers of components and interconnections are produced simultaneously, and with multilayer substrates the multitude of interconnections of digital circuits are made in a few conductor layers
Integration of power semiconductor devices
- Author(s): Peter Wetzel
- Source: Electronics & Power, Volume 26, Issue 9, p. 712 –714
- DOI: 10.1049/ep.1980.0374
- Type: Article
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In the power electronics field, integrated semiconductor devices are increasingly being used up to current loads of 100 A. Particular consideration must be paid to the problem of long-term stability under a high-voltage load. Recently developed modules have chips, passivated with glass for long-term stability, up to a periodic peak inverse voltage of 1600 V
Unsoldering p.c.b.s. without damage
- Author(s): J.A. Scarlett
- Source: Electronics & Power, Volume 26, Issue 9, p. 715 –718
- DOI: 10.1049/ep.1980.0375
- Type: Article
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Printed-circuit boards and soldered joints from the basis of almost all electronic equipments, and it might be thought that the industry should be now be so thoroughly familiar with both boards and joints that there can no longer be any major problems associated with the making and unmaking of joints. However, this is far from being the case
Telecommunication—the way ahead
- Author(s): J.S. Whyte
- Source: Electronics & Power, Volume 26, Issue 9, p. 719 –726
- DOI: 10.1049/ep.1980.0376
- Type: Article
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This article looks back at the progress made in telecommunication in the 1970s and forward into the 1980s. Developments in technology will lead to much greater diversity of customer services. These developments are forcing major changes in the nature and structure of the telecommunication manufacturing industry, and the process is not yet complete. The coming decade will also see substantial changes in the control and regulation of telecommunication administrations—the 1990s will show whether overall these changes have been benefical or not
The BPO national packet-switched network
- Author(s): A.R. Adam and E.J.B. Lee
- Source: Electronics & Power, Volume 26, Issue 9, p. 727 –732
- DOI: 10.1049/ep.1980.0377
- Type: Article
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The planned opening date for a new national packet-switched data service is Autumn 1980. Initial reaction from potential customers has demonstrated strong interest in the new service
Speech-band data modems
- Author(s): P.F. Adams
- Source: Electronics & Power, Volume 26, Issue 9, p. 733 –736
- DOI: 10.1049/ep.1980.0378
- Type: Article
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Speech-band data modems allow the analogue telephony network to be used for digital data communication. New techniques and technology are permitting further exploitation of the network in terms of higher data rates and efficient bidirectional transmission
Digital crosstalk measurement
- Author(s): D. Borley
- Source: Electronics & Power, Volume 26, Issue 9, p. 737 –740
- DOI: 10.1049/ep.1980.0379
- Type: Article
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As Britain's line communication network is converted to 2 Mbit/s digital line sections, overloading of systems on sigle lines is a potential problem. In order to detect the symptomatic crosstalk in the field, a microprocessor-based crosstalk measuring set has been developed
Telexcommunication
- Author(s): P. Corbishley and P.G. Hunt
- Source: Electronics & Power, Volume 26, Issue 9, p. 741 –744
- DOI: 10.1049/ep.1980.0380
- Type: Article
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Today, almost 50 years after its inception, telex is still the only fully interconnected international non-speech service, its terminals even being found on the flight decks of passenger airlines and the bridges of merchant ships linked to the shore by Marisat communication links
A century for TXE4
- Author(s): Sydney F. Smith
- Source: Electronics & Power, Volume 26, Issue 9, p. 745 –748
- DOI: 10.1049/ep.1980.0381
- Type: Article
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In April 1980, Standard Telephones & Cables Ltd. handed over to the British Post Office the 100th TXE4 exchange built by the company. TXE4 is an electronic switching system developed by STC for large telephone exchanges and uses reed-relay switching with stored-program distributed control
RC Active Circuits
- Author(s): G. Wilson
- Source: Electronics & Power, Volume 26, Issue 9, page: 749 –749
- DOI: 10.1049/ep.1980.0382
- Type: Article
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Electric Machines
- Author(s): D. O'Kelly
- Source: Electronics & Power, Volume 26, Issue 9, page: 749 –749
- DOI: 10.1049/ep.1980.0383
- Type: Article
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749
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High Level Languages for Microprocessor Projects
- Author(s): S.J. Young
- Source: Electronics & Power, Volume 26, Issue 9, page: 749 –749
- DOI: 10.1049/ep.1980.0384
- Type: Article
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IEEE Standard Test Procedures for Antennas
- Author(s): G.A. Hurd
- Source: Electronics & Power, Volume 26, Issue 9, page: 749 –749
- DOI: 10.1049/ep.1980.0385
- Type: Article
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Microcomputer Interfacing
- Author(s): R.M.F. Goodman
- Source: Electronics & Power, Volume 26, Issue 9, page: 750 –750
- DOI: 10.1049/ep.1980.0386
- Type: Article
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Telecommunication System Engineering
- Author(s): J.M. Griffiths
- Source: Electronics & Power, Volume 26, Issue 9, page: 750 –750
- DOI: 10.1049/ep.1980.0387
- Type: Article
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The 8080/8085 Microprocessor Book
- Author(s): W.R. Betts
- Source: Electronics & Power, Volume 26, Issue 9, page: 750 –750
- DOI: 10.1049/ep.1980.0388
- Type: Article
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