Electronics & Communication Engineering Journal
Volume 13, Issue 5, October 2001
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Volume 13, Issue 5
October 2001
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- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5,
- DOI: 10.1049/ecej:20010508
- Type: Article
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- Author(s): W. Tuttlebee
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, page: 194 –194
- DOI: 10.1049/ecej:20010507
- Type: Article
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- Author(s): R. Shepherd
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, p. 195 –203
- DOI: 10.1049/ecej:20010501
- Type: Article
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The BluetoothTM wireless technology is a cable replacement technology that exploits the wireless interconnectivity that is possible with radio. Bluetooth chips are already available and early applications include cordless connections from mobile phones to laptop computers and wireless headsets. Even if only 10% of mobile phones and computers were to incorporate Bluetooth chips, then the technology would achieve the critical mass necessary for chip prices to fall below $5 and for the standard to become firmly established in the market-place. It is expected that Bluetooth products will be present in the home, where applications will include: conversion of the humble cellphone to a short-range cordless handset; providing a link from a PC to the Internet; home automation and cable replacement; toys and white goods. This paper introduces the Bluetooth wireless technology and its applications and provides a concise description of its air interface and protocol stack. - Author(s): M. Phillips
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, p. 204 –208
- DOI: 10.1049/ecej:20010502
- Type: Article
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The BluetoothTM industry has set itself an ambitious goal of just $5 for the implementation of a complete receiver/transmitter, including its DSP-based subsystem and associated ROM and RAM. Although this is unlikely to be realised until Bluetooth wireless technology has achieved considerable market penetration and gained economy of scale through very high volume production, some manufacturers appear to be closer to this goal than others. CSR, for example, had shipped over 1 million of its BlueCore single-chip Bluetooth radios by June this year, and 48% of all Bluetooth equipped end-user products on the market now contain this chip. This article takes a look at some of the design techniques that CSR has employed to reduce cost as much as possible, and outlines some of the issues that are likely to affect how quickly the market ramps up. - Author(s): P. Marshall
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, p. 209 –212
- DOI: 10.1049/ecej:20010503
- Type: Article
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The limits to the `dot.com revolution' have been discovered the hard way and it has been recognised that TV and audio products are likely to be significant drivers in the development of digital networks in the home. The paper provides an overview of developments in the consumer electronics field from the TV manufacturer's perspective, their relationship to the home network and some of the problems faced. - Author(s): D. Evans
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, p. 213 –219
- DOI: 10.1049/ecej:20010504
- Type: Article
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The availability of digital entertainment devices is increasing rapidly and the need to interconnect them is ever more important. This paper gives a description of the technical standards that are key to the definition and design of high-speed integrated digital networks and the approach that is being taken to extend the network into the wireless domain. These standards address both the method of interconnection and the means to ensure that there is full interoperability between digital entertainment appliances in a user-friendly manner. - Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, page: 220 –220
- DOI: 10.1049/ecej:20010505
- Type: Article
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- Author(s): M. Forbes ; J. Gourlay ; M. Desmulliez
- Source: Electronics & Communication Engineering Journal, Volume 13, Issue 5, p. 221 –232
- DOI: 10.1049/ecej:20010506
- Type: Article
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Optoelectronic interconnects between VLSI chips have been identified by the Semiconductor Industry Association (SIA) Roadmap as one of the few solutions to overcoming the communication bandwidth bottleneck between VLSI chips. Large-scale demonstrators based on optical interconnects, when fully operational, can exhibit today the same aggregate bandwidth as that foreseen by the Roadmap for the year 2007. Massive parallelism, low input/output driving energy over large distances, and synchronous processing of hundreds of optical information input channels mean that these prototypes can potentially provide on/off communication rates in the tera-pin-Hz region (i.e., a total capacity of one terabit/s). After discussing the limitations of electrical interconnects this paper reviews the means of integrating optoelectronic components with VLSI chips, suitable types of optoelectronic device and the three main approaches to constructing optical data links: fibre-ribbons, planar waveguides and free-space optics.
Calendar
Wireless in the home
Bluetooth wireless technology in the home
Reducing the cost of Bluetooth systems
Home networking: a TV perspective
In-home wireless networking: an entertainment perspective
Book reviews
Optically interconnected electronic chips: a tutorial and review of the technology
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