Your browser does not support JavaScript!
http://iet.metastore.ingenta.com
1887

Influence of stress on rotational loss in silicon iron

Influence of stress on rotational loss in silicon iron

For access to this article, please select a purchase option:

Buy article PDF
£12.50
(plus tax if applicable)
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Proceedings of the Institution of Electrical Engineers — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

The stress sensitivity of rotational-power loss in silicon iron has been investigated. The loss increases with tensile stress applied parallel to the rolling direction and decreases with compression. The opposite occurs when the stress is applied perpendicular to the rolling direction. The loss varies in a similar fashion over the flux-density range investigated. Increasing the frequency causes the loss to rise drastically and also increases its stress sensitivity. It has also been shown theoretically that the angle of lag of the flux density behind the applied field increases with stress and varies during the magnetising cycle.

References

    1. 1)
      • R. Phillips , K.J. Overshott . Domain configuration under rotational flux and applied stress conditions in silicon-iron. IEEE Trans. , 168 - 169
    2. 2)
      • A.J. Moses , B. Thomas . Measurement of rotating flux in silicon-iron laminations. IEEE Trans. , 651 - 654
    3. 3)
      • C.R. Boon , J.E. Thompson . Alternating and rotational power loss at 50 c/s in 3% silicon-iron sheets. Proc. IEE , 11 , 2147 - 2151
    4. 4)
      • D.A. Ball , H.O. Lorch . An improved thermometric method of measuring local power dissipation. J. Sci. Instrum. , 90 - 93
    5. 5)
      • D. Brown , C. Holt , J.E. Thompson . Influence of compressive and tensile stresses at various temperature on magnetic properties of transformer laminations. Proc. IEE , 5 , 183 - 188
    6. 6)
      • A.J. Moses . Effects of stresses on magnetic properties of silicon-iron laminations. J. Mater. Sci. , 217 - 222
http://iet.metastore.ingenta.com/content/journals/10.1049/piee.1978.0045
Loading

Related content

content/journals/10.1049/piee.1978.0045
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
This is a required field
Please enter a valid email address