Bonding of silicon with filled and unfilled polymers based on black silicon

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Bonding of silicon with filled and unfilled polymers based on black silicon

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A bonding method for silicon wafers with unfilled and filled polymer components using ‘Black Silicon’ is presented. The working principle is an interconnection of ‘Black Silicon’ surfaces with ductile materials. Needles of nanostructured ‘Black Silicon’ with their increased surface and undercut features penetrate the polymer when applying pressure. Plastic deformations of the polymer lead to a permanent bond. The retention force exceeds 1000 N/cm2 as experiments with polypropylene and low temperature co-fired ceramic tapes (polymer filled with ceramic) show. The application areas are smart packaging, fluidic interconnects for microsystems, electronic assembly and hybrid polymer–ceramic silicon systems.

Inspec keywords: ceramics; elemental semiconductors; integrated circuit packaging; microfluidics; silicon; wafer bonding; nanostructured materials; plastic deformation; filled polymers; integrated circuit interconnections

Other keywords: filled polymer; fluidic interconnects; co-fired ceramic tapes; electronic assembly; ductile materials; silicon wafers; plastic deformations; polypropylene; bonding method; retention force; Si; hybrid polymer-ceramic silicon systems; smart packaging; nanostructured black silicon

Subjects: MEMS and NEMS device technology; Semiconductor integrated circuits; Product packaging; Metallisation and interconnection technology

References

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    2. 2)
      • J. Wei . Wafer bonding techniques for microsystem packaging. J. Phys., Conf. Ser. , 943 - 948
    3. 3)
    4. 4)
      • E. Müller , T. Bartnitzek , F. Bechtold , B. Pawlowski , P. Rothe , R. Ehrt , A. Heymel , E. Weil , T. Schroeter , S. Schundau , K. Kaschlik . (2005) Development and Processing of an Anodic Bondable LTCC Tape.
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