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Bonding of silicon with filled and unfilled polymers based on black silicon

Bonding of silicon with filled and unfilled polymers based on black silicon

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A bonding method for silicon wafers with unfilled and filled polymer components using ‘Black Silicon’ is presented. The working principle is an interconnection of ‘Black Silicon’ surfaces with ductile materials. Needles of nanostructured ‘Black Silicon’ with their increased surface and undercut features penetrate the polymer when applying pressure. Plastic deformations of the polymer lead to a permanent bond. The retention force exceeds 1000 N/cm2 as experiments with polypropylene and low temperature co-fired ceramic tapes (polymer filled with ceramic) show. The application areas are smart packaging, fluidic interconnects for microsystems, electronic assembly and hybrid polymer–ceramic silicon systems.

References

    1. 1)
      • J. Wei . Wafer bonding techniques for microsystem packaging. J. Phys., Conf. Ser. , 943 - 948
    2. 2)
      • E. Müller , T. Bartnitzek , F. Bechtold , B. Pawlowski , P. Rothe , R. Ehrt , A. Heymel , E. Weil , T. Schroeter , S. Schundau , K. Kaschlik . (2005) Development and Processing of an Anodic Bondable LTCC Tape.
    3. 3)
    4. 4)
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