Bonding of silicon with filled and unfilled polymers based on black silicon

Bonding of silicon with filled and unfilled polymers based on black silicon

For access to this article, please select a purchase option:

Buy article PDF
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Your details
Why are you recommending this title?
Select reason:
Micro & Nano Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

A bonding method for silicon wafers with unfilled and filled polymer components using ‘Black Silicon’ is presented. The working principle is an interconnection of ‘Black Silicon’ surfaces with ductile materials. Needles of nanostructured ‘Black Silicon’ with their increased surface and undercut features penetrate the polymer when applying pressure. Plastic deformations of the polymer lead to a permanent bond. The retention force exceeds 1000 N/cm2 as experiments with polypropylene and low temperature co-fired ceramic tapes (polymer filled with ceramic) show. The application areas are smart packaging, fluidic interconnects for microsystems, electronic assembly and hybrid polymer–ceramic silicon systems.


    1. 1)
      • J. Wei . Wafer bonding techniques for microsystem packaging. J. Phys., Conf. Ser. , 943 - 948
    2. 2)
      • E. Müller , T. Bartnitzek , F. Bechtold , B. Pawlowski , P. Rothe , R. Ehrt , A. Heymel , E. Weil , T. Schroeter , S. Schundau , K. Kaschlik . (2005) Development and Processing of an Anodic Bondable LTCC Tape.
    3. 3)
    4. 4)

Related content

This is a required field
Please enter a valid email address