access icon free Double trenches LDMOS with trapezoidal gate

A novel double trenches lateral double diffused metal oxide semiconductor with trapezoidal gate (TGDT LDMOS) is proposed. One feature of the device is that two dielectric trenches which are equivalent to two field plates are introduced in the drift region. The two dielectric trenches not only modulate the body electric field to improve the breakdown voltage (BV) of the device but also assist to deplete the drift region to reduce the specific on-resistance (R on,sp). The other feature is the presence of the trapezoidal gate which increases the gate oxide thickness to reduce the capacitance of gate and drain (C GD). Thereby the charge between the gate and drain (Q GD) is reduced, so that the conduction loss of the device is decreased. Compared with the conventional LDMOS with trapezoidal gate and the single trench LDMOS with trapezoidal gate, the figure of merit (FOM = BV2/R on,sp) of the TGDT LDMOS is increased by 112.5 and 54.5%, respectively. Compared with the conventional double trenches LDMOS with rectangle gate, the FOM is similar, but the Q GD is reduced by 45.7%. Simultaneously, the feasible process steps of the TGDT LDMOS are given in this work.

Inspec keywords: MOSFET

Other keywords: trapezoidal gate; single trench LDMOS; breakdown voltage; drift region; capacitance reduction; specific on-resistance; double trench LDMOS; TGDT LDMOS; gate oxide thickness; conduction loss; body electric field; double trench lateral double diffused metal oxide semiconductor; dielectric trenches

Subjects: Insulated gate field effect transistors

References

    1. 1)
    2. 2)
    3. 3)
      • 12. Singh, Y., Punetha, M.: ‘High performance SOI lateral trench dual gate power MOSFET’. Proc. IEEE Conf. on Communications, Devices and Intelligent Systems, 2012, pp. 137140.
    4. 4)
      • 6. Fan, J., Zou, Y., Wang, H., et al: ‘A novel structure of SOI lateral MOSFET with vertical field plate’. Proc. IEEE Int. Conf. on Optoelectronics and Microelectronics, 2015, pp. 360364.
    5. 5)
    6. 6)
    7. 7)
    8. 8)
    9. 9)
    10. 10)
    11. 11)
    12. 12)
      • 15. Baliga, B.: ‘Fundamentals of power semiconductor devices’ (Springer Science + Business Media, USA, 2008), pp. 409417.
    13. 13)
      • 10. Xu, D., Cheng, X., Wang, Z., et al: ‘New trench gate LDMOS for low power applications’. Proc. IEEE Int. Conf. on Ion Implantation Technology, 2014, pp. 14.
    14. 14)
    15. 15)
    16. 16)
http://iet.metastore.ingenta.com/content/journals/10.1049/mnl.2017.0532
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