© The Institution of Engineering and Technology
Recently, the study of power consumption and heat dissipation has attracted considerable research interest due to the development of various electric products. In this research, the authors replaced the solid conducting wire with a microfluidic channel and an electrolyte to conduct electricity and dissipate heat in a light-emitting diode (LED). The optical power and temperature of the LED using three electrolytes including salt (NaCl), sodium bicarbonate, and citric acid were measured. The measured optical power was the highest when NaCl was used as the electrolyte. The temperatures of the LED and at the bottom of the microfluidic channel were much lower when a liquid conductor was used as compared to when a solid conducting wire was used. The optical power of the LED obtained using a solid conducting wire was higher than that obtained using a liquid conductor. The temperature decreased and optical power increased with increasing flow rate. They hypothesised that a liquid conductor with a lower electric resistance would improve the optical power of the LED.
References
-
-
1)
-
5. Marcinichen, J.B., Olivier, J.A., Thome, J.R.: ‘On-chip two-phase cooling of datacenters: cooling system and energy recovery evaluation’, Appl. Therm. Eng., 2012, 41, pp. 36–51 (doi: 10.1016/j.applthermaleng.2011.12.008).
-
2)
-
8. Costa-Patry, E., Olivier, J., Nichita, B.A., et al: ‘Two-phase flow of refrigerants in 85 μm-wide multi-microchannels: part I – pressure drop’, Int. J. Heat Fluid Flow, 2011, 32, pp. 451–463 (doi: 10.1016/j.ijheatfluidflow.2011.01.005).
-
3)
-
9. Costa-Patry, E., Olivier, J., Michel, B., et al: ‘Two-phase flow of refrigerants in 85 μm-wide multi-microchannels: part II – heat transfer with 35 local heaters’, Int. J. Heat Fluid Flow, 2011, 32, pp. 464–476 (doi: 10.1016/j.ijheatfluidflow.2011.01.006).
-
4)
-
1. Yang, J., Zhou, M., Zhao, Y., et al: ‘Electrosorption driven by microbial fuel cells to remove phenol without external power supply’, Bioresource Technol., 2013, 150, pp. 271–277 (doi: 10.1016/j.biortech.2013.09.107).
-
5)
-
12. Yang, K.S., Chung, C.H., Lee, M.T., et al: ‘An experimental study on the heat dissipation of LED lighting module using metal/carbon foam’, Int. Commun. Heat Mass Transf., 2013, 48, pp. 73–79 (doi: 10.1016/j.icheatmasstransfer.2013.08.022).
-
6)
-
4. Marcinichen, J.B., Thome, J.R., Michel, B.: ‘Cooling of microprocessors with micro-evaporation: a novel two-phase cooling cycle’, Int. J. Refrig., 2010, 33, pp. 1264–1276 (doi: 10.1016/j.ijrefrig.2010.06.008).
-
7)
-
13. Kim, D., Lee, J., Kim, J., et al: ‘Enhancement of heat dissipation of LED module with cupric-oxide composite coating on aluminum-alloy heat sink’, Energy Convers. Manage., 2015, 106, pp. 958–963 (doi: 10.1016/j.enconman.2015.10.049).
-
8)
-
14. Jeong, M.W., Jeon, S.W., Lee, S.H., et al: ‘Effective heat dissipation and geometric optimization in an LED module with aluminum nitride (AlN) insulation plate’, Appl. Therm. Eng., 2015, 76, pp. 212–219 (doi: 10.1016/j.applthermaleng.2014.11.027).
-
9)
-
15. Deng, X., Luo, Z., Xia, Z., et al: ‘Active-passive combined and closed-loop control for the thermal management of high-power LED based on a dual synthetic jet actuator’, Energy Convers. Manage., 2017, 132, pp. 207–212 (doi: 10.1016/j.enconman.2016.11.034).
-
10)
-
6. Marcinichen, J.B., Wu, D., Paredes, S., et al: ‘Dynamic flow control and performance comparison of different concepts of two-phase on-chip cooling cycles’, Appl. Energy, 2014, 114, pp. 179–191 (doi: 10.1016/j.apenergy.2013.09.018).
-
11)
-
2. Mauro, A.W., Thome, J.R., Toto, D., et al: ‘Saturated critical heat flux in a multi-microchannel heat sink fed by a split flow system’, Exper. Therm. Fluid Sci., 2010, 34, pp. 81–92 (doi: 10.1016/j.expthermflusci.2009.09.005).
-
12)
-
16. Wang, M., Tao, H., Sun, Z., et al: ‘The development and performance of the high-power LED radiator’, Int. J. Therm. Sci., 2017, 113, pp. 65–72 (doi: 10.1016/j.ijthermalsci.2016.11.012).
-
13)
-
10. Zhang, L.Y., Zhang, Y.F., Chen, J.Q., et al: ‘Fluid flow and heat transfer characteristics of liquid cooling microchannels in LTCC multilayered packaging substrate’, Int. J. Heat Mass Transf., 2015, 84, pp. 339–345 (doi: 10.1016/j.ijheatmasstransfer.2014.12.079).
-
14)
-
17. Cohen, A.B., Kraus, A.D., Davidson, S.F.: ‘Thermal frontiers in the design and packaging of microelectronic equipment’, J. Mech. Eng., 1983, 105, (6), pp. 53–59.
-
15)
-
11. Cheng, H.H., Huang, D.S., Lin, M.T.: ‘Heat dissipation design and analysis of high power LED array using the finite element method’, Microelectron. Reliab., 2012, 52, pp. 905–911 (doi: 10.1016/j.microrel.2011.05.009).
-
16)
-
3. Park, J.E., Thome, J.R.: ‘Critical heat flux in multi-microchannel copper elements with low pressure refrigerants’, Int. J. Heat Mass Transf., 2010, 53, pp. 110–122 (doi: 10.1016/j.ijheatmasstransfer.2009.09.047).
-
17)
-
7. Agostini, B., Thome, J.R., Fabbri, M., et al: ‘High heat flux flow boiling in silicon multi-microchannels – part I: heat transfer characteristics of refrigerant R236fa’, Int. J. Heat Mass Transf., 2008, 51, pp. 5400–5414 (doi: 10.1016/j.ijheatmasstransfer.2008.03.006).
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