Your browser does not support JavaScript!

Design and application of an LED using a liquid conductor for dissipating heat and conducting electricity

Design and application of an LED using a liquid conductor for dissipating heat and conducting electricity

For access to this article, please select a purchase option:

Buy article PDF
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Your details
Why are you recommending this title?
Select reason:
Micro & Nano Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

Recently, the study of power consumption and heat dissipation has attracted considerable research interest due to the development of various electric products. In this research, the authors replaced the solid conducting wire with a microfluidic channel and an electrolyte to conduct electricity and dissipate heat in a light-emitting diode (LED). The optical power and temperature of the LED using three electrolytes including salt (NaCl), sodium bicarbonate, and citric acid were measured. The measured optical power was the highest when NaCl was used as the electrolyte. The temperatures of the LED and at the bottom of the microfluidic channel were much lower when a liquid conductor was used as compared to when a solid conducting wire was used. The optical power of the LED obtained using a solid conducting wire was higher than that obtained using a liquid conductor. The temperature decreased and optical power increased with increasing flow rate. They hypothesised that a liquid conductor with a lower electric resistance would improve the optical power of the LED.


    1. 1)
    2. 2)
    3. 3)
    4. 4)
    5. 5)
    6. 6)
    7. 7)
    8. 8)
    9. 9)
    10. 10)
    11. 11)
    12. 12)
    13. 13)
    14. 14)
      • 17. Cohen, A.B., Kraus, A.D., Davidson, S.F.: ‘Thermal frontiers in the design and packaging of microelectronic equipment’, J. Mech. Eng., 1983, 105, (6), pp. 5359.
    15. 15)
    16. 16)
    17. 17)

Related content

This is a required field
Please enter a valid email address