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access icon free Electrochemical activation of substrate surfaces in microelectroforming

  • Author(s): Ligeng Shao 1, 2 ; Liqun Du 2, 3 ; Liding Wang 2, 3
    • View affiliations
    • Affiliations: 1: Key Laboratory for New Energy Battery of Liaoning Province, Dalian Jiaotong University, Dalian 116028, People's Republic of China;
      2: Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116024, People's Republic of China;
      3: Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, People's Republic of China
  • Source: Volume 8, Issue 12, December 2013, p. 872 – 876
    DOI:  10.1049/mnl.2013.0484 , Online ISSN 1750-0443
© The Institution of Engineering and Technology
Received 15/08/2013, Accepted 01/11/2013, Published

Microelectroforming is a modern manufacturing process for producing metal microstructures in the field of microelectronic mechanical systems. Electrochemical activation of the substrate surfaces can enhance the adhesion strength between the electroforming layer and the substrate at the first stage of microelectroforming. The mechanism of current density affecting the activation of the substrate surfaces was explored. The cathodic overpotential was carried out with the chronopotentiometric method under different current density conditions. The current density at the first stage of microelectroforming was the largest contributor to the electrochemical activation of the substrate surfaces. As the current density was set in the range of 0.2–1.2 A/dm2, effective electrochemical activation occurred on the substrate surfaces. Although the current density was 0.4 A/dm2, the effect of substrate activation is optimal and the adhesion strength between the electroforming layer and the substrate reached its maximum.

Inspec keywords: micromechanical devices; microfabrication; electroforming; surface treatment; nickel; copper; current density; adhesion

Other keywords: Cu; electrochemical activation; manufacturing process; microelectronic mechanical system; metal microstructures; substrate surfaces; current density; chronopotentiometric method; cathodic overpotential; substrate activation; Ni; adhesion strength; microelectroforming

Subjects: Surface treatment and coating techniques; Other topics in materials science; Fabrication of MEMS and NEMS devices; Micromechanical and nanomechanical devices and systems; Electrochemistry and electrophoresis; Surface treatment and degradation of metals and alloys; Other specific mechanical properties (mechanical engineering); Forming processes; Preparation of metals and alloys (compacts, pseudoalloys); Micromechanics (mechanical engineering)

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