Your browser does not support JavaScript!
http://iet.metastore.ingenta.com
1887

Non-planar surface bonding with spray-coated SU-8 as adhesive layer

Non-planar surface bonding with spray-coated SU-8 as adhesive layer

For access to this article, please select a purchase option:

Buy article PDF
£12.50
(plus tax if applicable)
Add to cart
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)
Add to cart

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Micro & Nano Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

© The Institution of Engineering and Technology
Published

In this study, substrates with a large topography were aligned and bonded, and a spray-coated SU-8 was employed as the adhesive layer between two complementary non-planar surfaces. Both wafer-level and chip-level bonding were carried out with an alignment tolerance of 5 µm. The bonding pairs exhibited enhanced tensile strength and shearing strength compared to that of the planar surface bonding, which was influenced by the gap between the bonding surfaces. This technology meets the requirements of the wafer-level three-dimensional structure transfer and opens up possibilities for manufacturing more complicated microelectromechanical systems devices.

Inspec keywords: shear strength; tensile strength; photoresists; organic compounds; surface topography; adhesive bonding; spray coating techniques; wafer bonding

Other keywords: chip-level bonding; large topography; adhesive layer; bonding pairs; enhanced tensile strength; alignment tolerance; wafer-level three-dimensional structure transfer; microelectromechanical system devices; spray-coated SU-8; shearing strength; nonplanar surface bonding; wafer-level bonding; complementary nonplanar surfaces

Subjects: Spray coating techniques; Deformation and plasticity; Mechanical and acoustical properties of solid surfaces and interfaces; Solid surface structure; Deformation, plasticity and creep

References

    1. 1)
    2. 2)
    3. 3)
    4. 4)
      • Zhang, J., Wang, C.H.: `A bump transfer method for flip chip assembly', Proc. IEEE 5th Int. Conf. EPTC, Singapore, 2003, p. 321–323.
    5. 5)
      • Liu, F., Yu, R.R., Young, A.M.: `A 300 mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding', Proc. IEEE Int. IEDM, San Francisco, CA, USA, 2008, p. 1–4.
    6. 6)
    7. 7)
      • Gianchandani, Y.: `Batch fabrication and assembly of micromotor-driven mechanisms with multi-level linkages', Proc. IEEE 5th Int. Conf. MEMS, Travemünde, Germany, p. 141–146.
    8. 8)
      • Shu, Q., Chen, X.H.J.: `Wafer bonding with intermediate parylene layer', Proc. 9th Int. Conf. ISCICT, Beijing, China, 2008, p. 2428–2431.
http://iet.metastore.ingenta.com/content/journals/10.1049/mnl.2012.0582
Loading

Related content

content/journals/10.1049/mnl.2012.0582
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
Print this page
This is a required field
Please enter a valid email address