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Design, fabrication and actuation of four-axis thermal actuating image stabiliser

Design, fabrication and actuation of four-axis thermal actuating image stabiliser

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Presented is a microelectromechanical system-based thermal actuating image stabiliser. The proposed stage has dimensions of 14.9×14.9×0.2 mm3 and contains a four-axis decoupling XY stage used for anti-shaking. The processes used to fabricate the stabiliser include silicon on isolator process, inductively coupled plasma process and flip-chip bonding technique. The maximum actuating distance of the stage is larger than 25 µm, which is sufficient to resolve the shaking problem in 3× optical zoom condition. According to the experiment results, the supplied voltage for the 25 µm moving distance is lower than 20 V, and the dynamic resonant frequency of the actuating device is 4.7 kHz.

Inspec keywords: elemental semiconductors; microactuators; silicon; microfabrication; image sensors; flip-chip devices; plasma materials processing

Other keywords: microelectromechanical system; Si; flip-chip bonding; isolator process; inductively coupled plasma process; actuating distance; optical zoom condition; four-axis decoupling XY stage; thermal actuating image stabiliser; antishaking; dynamic resonant frequency

Subjects: Plasma applications in manufacturing and materials processing; Fabrication of MEMS and NEMS devices; Microassembly techniques; Microactuators; Micromechanical and nanomechanical devices and systems; Image sensors; Design and modelling of MEMS and NEMS devices; Image detectors, convertors, and intensifiers

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