Acoustic fields from PVDF interdigital transducers

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Acoustic fields from PVDF interdigital transducers

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Interdigital transducers (IDTs) made from the piezoelectric polymer PVDF have been built; they transmit ultrasonic Lamb waves into 1–2 mm thick steel and aluminium plates and receive signals reflected from features in the structure. The IDTs are designed to be permanently bonded to the structure under inspection. Such IDTs have considerable potential for use in smart-structure monitoring applications. However, before this potential can be realised, the nature of the acoustic field that they produce must be thoroughly understood. Experimentally measured acoustic fields are presented for two example IDTs, one that produces a collimated beam for line inspection and one that produces a divergent beam for sector inspection. The development of modelling software based on Huygens' principle, which enables the acoustic field from such IDTs to be predicted rapidly, is then described. Example results from this software are presented and compared with experimental measurements. Further predictions made with the model are then used to elucidate certain basic guidelines for IDT design.

Inspec keywords: test equipment; inspection; nondestructive testing; physics computing; intelligent structures; acoustic generators; acoustic field; interdigital transducers; ultrasonic transducers; surface acoustic wave transducers; acoustic variables measurement; polymer films

Other keywords: PVDF interdigital transducers; sector inspection; Huygens' principle; smart-structure monitoring; inspection; collimated beam; piezoelectric polymer PVDF; IDT design; divergent beam; Al; acoustic field; modelling software; 1 to 2 mm; steel plates; Al plates; ultrasonic Lamb waves; line inspection

Subjects: Other nonelectric variables measurement; Transduction; devices for the generation and reproduction of sound; Testing equipment; Nondestructive testing; Measurement of acoustic variables; Acoustic wave devices; Sonic and ultrasonic transducers and sensors; Physics and chemistry computing; Materials testing

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