Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging
Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging
- Author(s): A.P. Papachristoforos
- DOI: 10.1049/ip-map:19990449
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- Author(s): A.P. Papachristoforos 1
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View affiliations
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Affiliations:
1: Department of Electrical Engineering, Division of Computer Science, National Technical University of Athens, Athens , Greece
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Affiliations:
1: Department of Electrical Engineering, Division of Computer Science, National Technical University of Athens, Athens , Greece
- Source:
Volume 146, Issue 4,
August 1999,
p.
285 – 291
DOI: 10.1049/ip-map:19990449 , Print ISSN 1350-2417, Online ISSN 1359-706X
The method of lines (MOL) is extended for the analysis of different geometries that include both rectangular and cylindrical conductors. The method of analysis is valid for multilevel dielectric structures. The cylindrical conductors can have circular pads and rectangular microstrips that are attached to the pads or the main body of the cylindrical via (buried microstrips). The mixed structures can include many ground planes with circular openings through which the via passes. The results are compared with previous results.
Inspec keywords: capacitance; microstrip lines; packaging; conducting bodies; dielectric bodies; method of lines
Other keywords:
Subjects: Waveguides and microwave transmission lines; Product packaging; Packaging; Transmission line theory
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