Electron - beam annealing of B-, P-, As-, Sb-, and Ga-implanted silicon by multiple-scan method
Data are presented on the sheet resistance of ion-implanted silicon following isothermal electron-beam annealing by the multiple-scan method. Anneals were performed on implanted 5 mm square chips for times around 5 s, with anneal temperatures up to 1350°C. Implants of As, P, B, Sb and Ga were annealed, ranging in doses from 1013 cm−2 to 1016 cm−2 in both (100) and (111) orientation silicon, and the sheet resistance was measured with a four-point probe. The measurements are presented as a plot of sheet resistance against electron-beam power, for a given dopant and anneal time, and the corresponding temperatures are also shown. Above a threshold temperature region of 750°C to 950°C near-full electrical activation is obtained, except in cases where the doping level approaches the solid solubility limit, or for certain high-dose boron implants. Slightly lower sheet resistances are obtained for implants in (100) material than (111) material, and at temperatures exceeding 1100°C diffusion effects are expected to be significant. The activation of ion implants without significant redistribution of dopant during annealing can be used to improve the performance of ion-implanted devices.
