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Innovative low-cost power module

Innovative low-cost power module

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IEE Proceedings - Circuits, Devices and Systems — Recommend this title to your library

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Semelab has developed the Smartpack®, a compact plastic power module that represents a breakthrough in the packaging of semiconductor die. By virtue of its novel construction, the Smartpack is able to offer significant cost advantages. The Smartpack structure is compared with conventional module technology. The relative thermal performance is examined using finite-element analysis. Details of Smartpack applications are provided, illustrating the module's inherent adaptability. Finally, the suitability of Smartpack for the high-reliability market is addressed.

References

    1. 1)
      • Smartpack is a registered Trademark of SmartPack TECNOLOGIAS.A. under Patent Number P9302702.
    2. 2)
      • Goodfellow catalogue, Goodfellow Cambridge Ltd, Cambridge,UK.
    3. 3)
      • M.P. Rodriguez , N.Y.A. Shammas , A.T. Plumpton , D. Newcombe , D.E. Crees . Static and dynamic finite element modelling of thermal fatigue effectsin insulated gate bipolar transistor modules. Microelectron. Reliab. , 3 , 455 - 463
    4. 4)
      • MIL-STD-750D, 18 May 1995.
    5. 5)
      • ANSYS Inc, Houston, PA, USA, `ANSYS analysis manual', .
    6. 6)
      • MIL-STD-883E, 31 Dec 1996.
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