access icon free Analysis and design of defected ground structure for EMC improvement in mixed-signal transceiver modules

© The Institution of Engineering and Technology
Received 14/10/2019, Accepted 04/05/2020, Revised 27/01/2020, Published 13/05/2020

In this research, the return path discontinuity (RPD), located under the power amplifier (PA) substrate, of X-band transceiver module (Base), mounted on a four-layer printed circuit board (PCB), is investigated to improve the signal integrity by reducing the difference in the reference potential. This study is performed by initially employing the wirebond method, through the assessment of both numbers and sizes of bondwires by advanced design system (ADS). Six bondwires of 25 µm are added, producing an improvement of 6.82 dB for the reflection coefficient and 1.19 dB for the isolation and insertion loss. For further improvement, spiral shape defected ground structure (DGS) is implemented in the inner ground layer (layer 2) without using bond wires. The DGS simulation results illustrate an improvement of 3 dB for S 11 and 0.6 dB for S 12. To improve the electromagnetic compatibility (EMC), the authors propose combination and integration of both wirebond and DGS methods, called wirebond–DGS method, which results in an improvement of 11.86 dB for S 11, 1.34 dB for S 12 and S 21, and 12.03 dB for S 22. Finally, the wirebond–DGS RF module was fabricated and the measurement results exhibit an improvement of 8.07 dB for S 11 and 9.39 dB for S 22 in comparison with the fabricated Base module. In addition, 0.53 dB improvement for both S 12 and S 21 is also achieved.

Inspec keywords: transceivers; lead bonding; power amplifiers; electromagnetic compatibility; mixed analogue-digital integrated circuits; defected ground structures; microwave integrated circuits; printed circuits

Other keywords: DGS simulation; X-band transceiver module; EMC improvement; inner ground layer; reference potential; mixed-signal transceiver modules; power amplifier substrate; ADS; signal integrity; four-layer PCB; insertion loss; wirebond–DGS method; size 25.0 mum; return path discontinuity; RPD; wirebond–DGS RF module; spiral shape defected ground structure; electromagnetic compatibility; wirebond method; fabricated base module

Subjects: Semiconductor integrated circuits; Electromagnetic compatibility and interference; Microwave integrated circuits; Amplifiers; Microassembly techniques; Printed circuits; Waveguide and microwave transmission line components

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