RT Journal Article
A1 Salomeh Heidari
A1 Nasser Masoumi
A1 Jalil Rashed Mohassel
A1 Noushin Karimian
A1 Safieddin Safavi-Naeini

PB iet
T1 Analysis and design of defected ground structure for EMC improvement in mixed-signal transceiver modules
JN IET Science, Measurement & Technology
VO 14
IS 7
SP 825
OP 834
AB In this research, the return path discontinuity (RPD), located under the power amplifier (PA) substrate, of X-band transceiver module (Base), mounted on a four-layer printed circuit board (PCB), is investigated to improve the signal integrity by reducing the difference in the reference potential. This study is performed by initially employing the wirebond method, through the assessment of both numbers and sizes of bondwires by advanced design system (ADS). Six bondwires of 25 µm are added, producing an improvement of 6.82 dB for the reflection coefficient and 1.19 dB for the isolation and insertion loss. For further improvement, spiral shape defected ground structure (DGS) is implemented in the inner ground layer (layer 2) without using bond wires. The DGS simulation results illustrate an improvement of 3 dB for S 11 and 0.6 dB for S 12. To improve the electromagnetic compatibility (EMC), the authors propose combination and integration of both wirebond and DGS methods, called wirebond–DGS method, which results in an improvement of 11.86 dB for S 11, 1.34 dB for S 12 and S 21, and 12.03 dB for S 22. Finally, the wirebond–DGS RF module was fabricated and the measurement results exhibit an improvement of 8.07 dB for S 11 and 9.39 dB for S 22 in comparison with the fabricated Base module. In addition, 0.53 dB improvement for both S 12 and S 21 is also achieved.
K1 EMC improvement
K1 four-layer PCB
K1 ADS
K1 inner ground layer
K1 electromagnetic compatibility
K1 size 25.0 mum
K1 insertion loss
K1 DGS simulation
K1 wirebond–DGS RF module
K1 return path discontinuity
K1 fabricated base module
K1 power amplifier substrate
K1 X-band transceiver module
K1 wirebond method
K1 RPD
K1 signal integrity
K1 reference potential
K1 wirebond–DGS method
K1 spiral shape defected ground structure
K1 mixed-signal transceiver modules
DO https://doi.org/10.1049/iet-smt.2019.0463
UL https://digital-library.theiet.org/;jsessionid=h13iednboo33s.x-iet-live-01content/journals/10.1049/iet-smt.2019.0463
LA English
SN 1751-8822
YR 2020
OL EN