access icon free Impact of thermal annealing on internal device parameters of GaAs0.965Bi0.035/GaAs0.75P0.25 quantum well lasers

The impact of post-growth thermal annealing on the internal device parameters such as internal loss (αi ), internal differential quantum efficiency () and modal material gain (Γg 0J ) of a single-quantum well (QW) laser diodes employing GaAs0.965Bi0.035/GaAs0.75P0.25 active regions and emitting near λ∼980 nm was investigated. Parameter extraction from a conventional cavity length analysis indicates that the internal loss remains unchanged while internal differential quantum efficiencies degrade as the annealing time increases. Also, the variation of the modal material gain with annealing correlates to the corresponding change in the photoluminescence intensity. Comparisons between single- and double-QW devices indicate that the relatively high internal loss originates from the QW active region.

Inspec keywords: III-V semiconductors; quantum well lasers; gallium arsenide; annealing; semiconductor quantum wells; photoluminescence; optical losses; laser beams; laser cavity resonators

Other keywords: internal loss; parameter extraction; double-QW devices; QW active region; post-growth thermal annealing; single-QW devices; internal differential quantum efficiency; photoluminescence intensity; single-quantum well laser diodes; GaAs0.965Bi0.035-GaAs0.75P0.25; internal device parameters; conventional cavity length analysis; modal material gain; annealing time

Subjects: Design of specific laser systems; Lasing action in semiconductors; Laser resonators and cavities; Other heat and thermomechanical treatments; Annealing processes in semiconductor technology; Laser beam interactions and properties; Photoluminescence in II-VI and III-V semiconductors; Laser resonators and cavities; Laser beam characteristics and interactions; Semiconductor lasers

http://iet.metastore.ingenta.com/content/journals/10.1049/iet-opt.2018.5031
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content/journals/10.1049/iet-opt.2018.5031
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