Embedded system for sensor communication and security

Embedded system for sensor communication and security

For access to this article, please select a purchase option:

Buy article PDF
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Your details
Why are you recommending this title?
Select reason:
IET Information Security — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

Inter-integrated circuit mode (I2C) software is used to communicate between sensors and on embedded control system utilising PIC182585 MPLAB hardware. These sensors were built as part of a system on-board that includes sensors, a Q2 microcontroller and interface circuitry. The hardware includes a PIC18 processor, a field programmable gate array (FPGA) chip and peripherals. The FPGA chip is used to interface the processor with the peripherals operating at the same clock speed. This hardware design features high-level integration, reliability, high precision and high-speed communications. The system was demonstrated using temperature and CO2 sensors. The overall system was implemented and successfully tested. The response of the multi-sensor system was agreeable with the design parameters. The system is expandable to include other sensors such as light and pressure sensors. Monitoring threshold values should add to the security features of the integrated communication system. The use of a signature detection algorithm to determine threatening situation and/or intrusion within the sittings are discussed as a potential application for home land security. The integrated system features low-power consumption (utilising the sleeping mode of the processors), high-speed communications, security and flexibility to expansion.


    1. 1)
      • Rusu, M., Saplacan, G., Sebestyen, G.: `Distributed e-health system with smart self-care units', Proc. IEEE Fifth Int. Conf. on Intelligent Computer Communication and Processing, 2009, ICCP 2009, 27–29 August 2009, Cluj-Napoca, p. 307–314.
    2. 2)
    3. 3)
      • Cater, N.E., O'Reilly, T.: `Promoting interoperable ocean sensors the smart ocean sensors consortium', Proc. OCEANS 2009, MTS/IEEE Biloxi – Marine Technology for Our Future: Global and Local Challenges, 26–29 October 2009, Biloxi, MS, p. 1–6.
    4. 4)
      • Bixio, L., Ciardelli, L., Ottonello, M., Regazzoni, C.S.: `Distributed cognitive sensor network approach for surveillance applications', Proc. Sixth IEEE Int. Conf. on Advanced Video and Signal based Surveillance, 2009, AVSS '09, 2–4 September 2009, Genova, p. 232–237.
    5. 5)
      • Wang, Y., Casares, M., Velipasalar, S.: `Cooperative object tracking and event detection with wireless smart cameras', Proc. Sixth IEEE Int. Conf. Advanced Video and Signal Based Surveillance, 2009, AVSS '09, 2–4 September 2009, Genova, p. 394–399.
    6. 6)
    7. 7)
      • Marek, J.: `MEMS for automotive and consumer electronics', Proc. 2010 IEEE Int. Solid-State Circuits Conf., Digest of Technical Papers (ISSCC), 7–11 February 2010, San Francisco, CA, USA, p. 9–17.
    8. 8)
    9. 9)
      • Ibrahim, F., Barbic, M., Druzgalski, C.: `Stripe sensor tomography and application to microcoil magnetic resonance imaging', Proc. Pan American Health Care Exchanges, 2009, PAHCE 2009, 16–20 March 2009, Mexico City, p. 153–153.
    10. 10)
    11. 11)
      • Li, P., Li, Y., Seem, J.E.: `Extremum seeking control for efficient and reliable operation of air-side economizers', Proc. American Control Conf., 2009, ACC '09, 10–12 June 2009, St. Louis, MO, p. 20–25.
    12. 12)
      • Takagi, Y., Yonezawa, K., Nishimura, N., Hanada, Y., Yamazaki, K.: `Next generation HVAC system for office buildings – the optimal control structure for DHC buildings', Proc. ICCAS-SICE, 2009, 18–21 Aug. 2009, Fukuoka, p. 2002–2007.
    13. 13)
      • Borggaard, J., Burns, J.A., Surana, A., Zietsman, L.: `Control, estimation and optimization of energy efficient buildings', Proc. 2009 American Control Conf., ACC 2009, 10 June 2009–12 June 2009, St. Louis, MO, USA, p. 837–841.
    14. 14)
      • Abu-Siada, A., Bahram, M.: `Effect of HVAC system on neighbouring pipelines and communication cables', Proc. Australasian Universities Power Engineering Conf., 2009, AUPEC 2009, 27–30 September 2009, Adelaide, SA, p. 1–5.
    15. 15)
      • Popa, M., Popa, A.S., Gambutan, A.T.: `Remote temperature monitoring and regulating system for indoor locations', Proc. Fifth Int. Symp. on Applied Computational Intelligence and Informatics, 2009, SACI '09, 28–29 May 2009, Timisoara, p. 235–240.
    16. 16)
    17. 17)
      • Li, C.-L., Chung, S.-L., Lee, J.-N.: `Modeling of automobile air conditioning systems', Proc. Chinese Control and Decision Conf., 2009, CCDC '09, 17–19 June 2009, Guilin, p. 974–979.
    18. 18)
      • Laisheng, X., Xiaohong, P., Zhengxia, W., Bing, X., Pengzhi, H.: `Research on traffic monitoring network and its traffic flow forecast and congestion control model based on wireless sensor networks', Proc. Int. Conf. on Measuring Technology and Mechatronics Automation, 2009, ICMTMA '09, 11–12 April 2009, Zhangjiajie, Hunan, p. 142–147.
    19. 19)
    20. 20)
      • Furthmuller, J., Kessler, S., Waldhorst, O.P.: `Energy-efficient management of wireless sensor networks', Proc. 2010 Seventh Int. Conf. on Wireless On-demand Network Systems and Services (WONS), 3–5 February 2010, Kranjska Gora, Slovenia, p. 129–136.
    21. 21)
    22. 22)
      • Silva, A.F., Mendes, P.M., Correia, J.H., Goncalves, F., Ferreira, L.A., Araujo, F.M.: `Smart sensing polymeric foil with integrated optic fiber sensors: fabrication and characterization of a polymeric foil sensitive to strain', Proc. Third Int. Conf. on Sensor Technologies and Applications, 2009, SENSORCOMM '09, 18–23 June 2009, Athens, Glyfada, p. 90–93.
    23. 23)
      • Peng, S.-Y., Gurun, G., Twigg, C.M.: `A large-scale reconfigurable smart sensory chip', Proc. IEEE Int. Symp. on Circuits and Systems, 2009, ISCAS 2009, 24–27 May 2009, Taipei, p. 2145–2148.
    24. 24)
    25. 25)
      • Cao, Y., Tang, F., Bermak, A., Le, T.: `A smart CMOS image sensor with on-chip hot pixel correcting readout circuit for biomedical applications', Proc. Fifth IEEE Int. Symp. on Electronic Design, Test and Application, 2010, DELTA '10, 13–15 January 2010, Ho Chi Minh City, Vietnam, p. 103–107.
    26. 26)
    27. 27)
      • Graciano, M.L., Romariz, A.R.S., da Costa, J.C.: `CMOS image sensor device for objective evaluation of video quality in mass distribution networks', Proc. 2010 Seventh IEEE Consumer Communications and Networking Conf. (CCNC), 9–12 January 2010, Las Vegas, NV, p. 1–2.
    28. 28)
    29. 29)
      • SST Inc. products datasheets,, accessed September 2010.
    30. 30)
      • Radada, J.: `A highly precise and linear IC for heat pulse thermal bidirectional mass flow sensor', May 2010, MSECE, ECE, Purdue University.

Related content

This is a required field
Please enter a valid email address