References

• 1. 1)
     • 64. Ghandhi, S.K.: ‘Semiconductor power devices’ (Wiley, 1977, republished 1998).
  2. 2)
     • 38. Perovic, D.: ‘Making the impossible, possible – overcoming the design challenges of in wheel motors’, EVS26 Int. Battery, Hybrid and Fuel Cell Electric Vehicle Symp., 2012, 5, pp. 514–519.
  3. 3)
     • 24. Farina, F., Rossi, D., Tenconi, A., et al: ‘Thermal design of integrated motor drives for traction applications’, Power Electron. Eur. Appl., 2005, p. 10.
  4. 4)
     • 130. ROHM full SiC power Module Data sheet. Available at http://rohmfs.rohm.com/en/products/databook/datasheet/discrete/sic/power_module/bsm180d12p2c101.pdf, accessed 08 April 2015.
  5. 5)
     • 9. Thoegersen, P., Blaabjerg, F.: ‘Adjustable speed drives in the next decade. The next step in industry and academia’. Proc. of PCIM '00, Intelligent Motion, pp. 95–104.
  6. 6)
     • 148. Cressler, J.D., Mantooth, H.A.: ‘Extreme environment electronics’ (CRC Press, Florida, 2012).
  7. 7)
     • 11. Brown, N.R., Jahns, T.M., Lorenz, R.D.: ‘Development of a converter for an integrated modular motor drive’. Centre for Power Electronics Systems (CPES) 2007. CPES, pp. 419–425.
  8. 8)
     • 21. Wolmarans, J.J., Gerber, M.B., Polinder, H., et al: ‘A 50 kW integrated fault tolerant permanent magnet machine and motor drive’. IEEE Power Electronics Specialists Conf.. 2008, pp. 345–351.
  9. 9)
     • 166. Joo, S., Baldwin, D.F.: ‘Rapid prototyping of micro-systems packaging using a data-driven chip-first process and nano-particles metal colloids’, Proc. Electronic Components and Technology, ECTC ‘05, 2005, vol. 2, pp. 1859–1863.
  10. 10)
      • 200. Chandran, B., Schmidt, W.F., Gordon, M.H.: ‘A novel bonding technique to bond CTE mismatched devices’. Proc. Electronic Components and Technology Conf., 46th, May 1996, pp. 1151–1158, 28–31.
  11. 11)
      • 167. Parylene Properties. Available at http://scscoatings.com/what_is_parylene/parylene_properties.aspx, accessed 8 April 2015.
  12. 12)
      • 28. ‘Innovative motor technology for hybrid and electric vehicles’. Available at http://w3.siemens.com/topics/global/de/elektromobilitaet/PublishingImages/antriebe-pkw/pdf/sivetec-mrs-mri-siemens_en.pdf, accessed November 2015.
  13. 13)
      • 52. Johnson, R.W.: ‘A review of high temperature electronics packaging’. Proc. 1989' High Temperature Electronics Conf..
  14. 14)
      • 108. Parler, S.G.Jr.: ‘Deriving life multipliers for electrolytic capacitors’, IEEE Power Electron. Soc. Newsl., 2004, 16, pp. 11–12.
  15. 15)
      • 160. Welch III, W.C., Chae, J., Najafi, K.: ‘Transfer of metal MEMS packages using a wafer-level solder transfer technique’, IEEE Trans. Adv. Packag., 2005, 28, (4), pp. 643–649 (doi: 10.1109/TADVP.2005.859356).
  16. 16)
      • 155. Knoerr, M., Kraft, S., Schletz, A.: ‘Reliability assessment of sintered nano-silver die attachment for power semiconductors’. Proc. 12th Electron. Package. Technol. Conf., 2010, pp. 56–61.
  17. 17)
      • 4. Hornberger, J.M., Cilio, E., Schupbach, R.M., et al: ‘A high-temperature multichip power module (MCPM) inverter utilizing silicon carbide (SiC) and silicon on insulator (SoI) electronics’. Power Electronics Specialists Conf. PESC, 2006, pp. 1–7.
  18. 18)
      • 5. Babb, M., Bartos, F.: ‘Integrated motor drive combinations’, Control Eng. Eur., 2001, 57, (21), p. 66.
  19. 19)
      • 80. Baliga, B.J.: ‘Power semiconductor device figure of merit for high frequency applications’, IEEE Electron Device Lett., 1989, 10, (10), pp. 455–457 (doi: 10.1109/55.43098).
  20. 20)
      • 122. Neudeck, P.G., Matus, L.G.: ‘An overview of silicon carbide device technology’. Ninth Symp. on Space Nuclear Power Systems, 1992, pp. 12–16.
  21. 21)
      • 74. Weitzel, C.E., Palmour, J.W., Carter, C.H., et al: ‘Silicon carbide high power devices’, IEEE Trans. Electron Devices, 1996, 43, (10), pp. 1732–1741 (doi: 10.1109/16.536819).
  22. 22)
      • 177. Durapot Epoxies—High Performance Casting, Embedding and Encapsulating Compounds. Available at http://www.cotronics.com/vo/cotr/pdf/860.pdf, accessed 8 April 2015.
  23. 23)
      • 140. Johnson, R.W., Palmer, M., Wang, C., et al: ‘Packaging materials and approaches for high temperature SiC power devices’, Adv. Microelectron., 2004, 31, (1), pp. 8–11.
  24. 24)
      • 65. Baliga, B.J.: ‘Physics of semiconductor power devices’ (JWS Publishing, 1996).
  25. 25)
      • 124. Khazaka, R., Mendizabal, I., Henry, D., et al: ‘Survey of high-temperature reliability of power electronics packaging components’, IEEE Trans. Power Electron., 2015, 30, (5), pp. 2456–2464 (doi: 10.1109/TPEL.2014.2357836).
  26. 26)
      • 151. Xiao, Y., Natarajan, R., Chow, T.P., et al: ‘Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications’. 17th Annual IEEE Applied Power Electronics Conf. and Exposition, 2002. APEC 2002.2002, vol. 1, no., pp. 21–26.
  27. 27)
      • 35. ‘E-Trac IMD integrated motor drive’. Available at http://www.southernpower.com/pdf/woods/electronic_products_guide.pdf, accessed November 2015.
  28. 28)
      • 190. Chou, B., Beilin, S., Jiang, H., et al: ‘Multilayer high density flex technology’. Proc. 49th Electronic Components and Technology Conf., 1999.1999, vol., no., pp. 1181–1189.
  29. 29)
      • 186. Savrun, E., Wu, D.: ‘High-temperature dielectric properties of aluminum nitride’. High Temperature Electronics Conf. HITEC 2006, May 2006.
  30. 30)
      • 60. Liang, Z., Li, L.: ‘HybridPACK2 - advanced cooling concept and package technology for hybrid electric vehicles’. Vehicle Power and Propulsion Conf., VPPC '08. IEEE, September 2008, p. 1, 5, 3–5.
  31. 31)
      • 13. Marz, M., Schletz, A., Eckardt, B., et al: ‘Power electronics system integration for electric and hybrid vehicles’. 2010 Sixth Int. Conf. IEEE Integrated Power Electronics Systems (CIPS). pp. 1–10.
  32. 32)
      • 92. Benţia, I., Ruba, M., Szabó, L.: ‘Modular electrical machines – a survey’. Proc. of the Int. Scientific Conf. MicroCAD, 2010.
  33. 33)
      • 169. Cao, X., Wang, T., Ngo, K.D.T., et al: ‘Parametric study of joint height for a medium-voltage planar package’, IEEE Trans. Comp. Package. Technol., 2010, 33, (3), pp. 553–562 (doi: 10.1109/TCAPT.2010.2046639).
  34. 34)
      • 91. Trivedi, M., Shenai, K.: ‘Performance evaluation of high-power wide bandgap semiconductor rectifiers’, Am. Phys. Inst. J. Appl. Phys., 1999, 85, (9), pp. 6889–6897 (doi: 10.1063/1.370208).
  35. 35)
      • 53. Olesen, K., Bredtmann, R., Eisele, R.: ‘ShowerPower’ new cooling concept for automotive applications’, Automot. Power Electron., 2006, pp. 1–9.
  36. 36)
      • 56. McClusky, P., Grzybowski, R.R., Das, D., et al: ‘Packaging of electronics for high temperature applications’, Int. J. Microcircuits Electron. Packag., 1997, 20, (3), pp. 409–423.
  37. 37)
      • 187. Mounce, S., McPherson, B., Schupbach, R., et al: ‘Ultra-lightweight, high efficiency sic based power electronic converters for extreme environments’. Aerospace Conf., IEEE, 2006, p. 19.
  38. 38)
      • 149. Cheng, C.H., siao, H.L., Chu, S.I., et al: ‘Low cost silver alloy wire bonding with excellent reliability performance’. 2013 IEEE 63rd Electronic Components and Technology Conf. (ECTC), 28–31 May 2013, vol., no., pp. 1569–1573.
  39. 39)
      • 168. Hiromasa, M., Keiichi, E., Satoru, K.: ‘Application of silver nano particle to pressureless bonding onto a copper surface – consideration of substitute material for lead solder’. 2014 Eighth Int. Conf. on Integrated Power Systems (CIPS), 25–27 February 2014, vol., no., pp. 1–5.
  40. 40)
      • 87. Tolbert, L.M., Ozpineci, B., King, T.J., , et al: ‘Power electronics for distributed energy systems and transmission and distribution applications’, 2005.
  41. 41)
      • 20. Tenconi, A., Profumo, F., Bauer, S.E., et al: ‘Temperatures evaluation in an integrated motor drive for traction applications’, IEEE Trans. Ind. Electron., 2008, 55, (10), pp. 3619–3626 (doi: 10.1109/TIE.2008.2003099).
  42. 42)
      • 111. Sarjeant, W.J., Zirnheld, J., MacDougall, F.W.: ‘Capacitors’, IEEE Trans. Plasma Sci., 1998, 26, (5), pp. 1368–1392 (doi: 10.1109/27.736020).
  43. 43)
      • 1. Bartos, F.J.: ‘Combination motors and drives move to make their mark’ Control Engineering Online, December 2000. Available at http://www.csemag.com/single-article/combination-motors-and-drives-move-to-make-their-mark/d9a8ab08897749f02e39653c06a6cc49.html.
  44. 44)
      • 176. Wong, C.P., Segelken, J.M., Balde, J.W.: ‘Understanding the use of silicone gels for non-hermetic plastic packaging’, IEEE Trans. Compon., Hybrids Manuf. Technol., 1989, 12, (4), pp. 421–425 (doi: 10.1109/33.48998).
  45. 45)
      • 76. Ozpineci, B., Tolbert, L.M.: ‘Comparison of wide-band gap semiconductors for power electronics applications’. (Department of Energy, United States, 2003).
  46. 46)
      • 146. Pooch, M.H., Dittmer, K.J., Gabisch, D.: ‘Investigations on the damage mechanism of aluminium wire bonds used for high power applications’. Proc. European Conf. Electronics Packaging Technology, 1996, pp. 128–131.
  47. 47)
      • 142. Salmon, J.S., Johnson, R.W., Palmer, M.: ‘Thick film hybrid packaging techniques for 500°C operation’. Proc. Fourth Int. High Temperature Electronics Conf. (HITEC), 1998, pp. 103–108.
  48. 48)
      • 193. Pascariu, G., Cronin, P., Crowley, D.: ‘Next generation electronics packaging utilizing flip chip technology’. IEEE/CPMT/SEMI 28th Int. Electronics Manufacturing Technology Symp. IEMT 2003.July 2003, pp. 423–4426, 16–18.
  49. 49)
      • 170. Cao, X., Wang, T., Ngo, K.D.T., et al: ‘Height optimization for a medium-voltage planar package’. Proc. 24th Annual IEEE Applied Power Electronics Conf. Exposition, Washington D.C., February 2009, pp. 479–484.
  50. 50)
      • 112. Yaohong, C., Fuchang, L., Hua, L.: ‘Study on self-healing and lifetime characteristics of metallized film capacitor under high electric field’. Pulsed Power Conf. (PPC), 2011, pp. 711–716.
  51. 51)
      • 156. Buttay, C., Masson, A., Li, J., et al: ‘Die attach of power devices using silver sintering bonding process optimization and characterization’, The IMAPS High Temperature Electronics Network., 2011, pp. 1–7.
  52. 52)
      • 126. Bai, J.G., Yin, J., Zhang, Z., et al: ‘High temperature operation of SiC power devices by low-temperature sintered silver die-attachment’, IEEE Trans. Adv. Package., 2007, 30, (3), pp. 506–510 (doi: 10.1109/TADVP.2007.898628).
  53. 53)
      • 125. Funaki, T., Balda, J.C., Junghans, J., et al: ‘Power conversion with SiC devices at extremely high ambient temperatures’, IEEE Trans. Power Electron., 2007, 22, (4), pp. 1321–1329 (doi: 10.1109/TPEL.2007.900561).
  54. 54)
      • 104. Teverovsky, A.: ‘Insulation resistance and leakage currents in low-voltage ceramic capacitors with cracks’, IEEE Trans. Compon. Packag. Manuf. Technol., 2014, 4, (7), pp. 1169–1176 (doi: 10.1109/TCPMT.2014.2318178).
  55. 55)
      • 69. Hornberger, J., Lostetter, A.B., Olejniczak, K.J., et al: ‘Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments’. 4 IEEE Aerospace Conf., Proc.. 2004, pp. 2538–2555.
  56. 56)
      • 66. Shur, M.S., Gaska, R., Khan, A., et al: ‘Wide band gap electronic devices’. Fourth IEEE Int. Caracas Conf. on Devices, Circuits and Systems. IEEE, 2002, pp. 51–58.
  57. 57)
      • 175. Davis, J.H., Rees, D.W., Riley, I.H.: ‘Silicone encapsulating and potting materials’. Proc. IEE-B, Electronics Communication Engineering, 1962, vol. 109, no. 21, pp. 266–270.
  58. 58)
      • 44. ‘Rockwell Automation – Kinitex 6000’. Available at http://literature.rockwellautomation.com/idc/groups/literature/documents/td/gmc-td001_-en-p.pdf, accessed November 2015.
  59. 59)
      • 183. Niwa, K., Nakamura, J., Murakawa, K., et al: ‘New alumina substrate for hybrid integrated circuits’, IEEE Trans. Parts Hybrids Packag., 1974, 10, (4), pp. 262–266 (doi: 10.1109/TPHP.1974.1134864).
  60. 60)
      • 135. Ning, P., Lai, R., Huff, D., , et al: ‘SiC wirebond multichip phase-leg module packaging design and testing for harsh environment’, IEEE Trans. Power Electron., 2010, 25, (1), pp. 16–23 (doi: 10.1109/TPEL.2009.2027324).
  61. 61)
      • 25. ‘Schneider Lexium 32i’. Available at http://download.schneider-electric.com/files?p_Reference=0198441113956-EN&p_EnDocType=User%20guide&p_File_Id=681840597&p_File_Name=LXM32iECT_Manual_V100_EN.pdf, accessed November 2015..
  62. 62)
      • 95. Klumpner, C., Blaabjerg, F., Thogersen, P.: ‘Evaluation of the converter topologies suited for integrated motor drives’. 38th IAS Annual Meeting Conf. Record of the Industry Applications Conf., IEEE., 2003, vol. 2, pp. 890–897.
  63. 63)
      • 8. Williamson, S., Jackson, D.C.: ‘Integrated drives for industrial applications’. Proc. of PCIM'99, Intelligent Motion, 1999, pp. 9–13.
  64. 64)
      • 163. McCluskey, F.P., Wang, Z., Dash, M., et al: ‘Reliability of high temperature solder alternatives’. High Temperature Electronics Conf. HITEC, 2006.
  65. 65)
      • 179. Technical Data Sheet—QSIL 550 2-Part Addition Cure Encapsulant. Available at http://www.acc-silicones.com/content/products/qsil573.ashx, accessed 8 April 2015.
  66. 66)
      • 136. Katsis, D., Zheng, Y.: ‘Development of an extreme temperature range silicon carbide power module for aerospace applications’. Proc. 39th IEEE Power Electron. Spec. Conf., 2008, pp. 290–294.
  67. 67)
      • 201. Gerber, M., Marz, M.: ‘System integration in automotive power systems’. European Conf. on Power Electronics and Applications, September 2005, pp. 10–14.
  68. 68)
      • 85. Microsemi PPG: ‘Gallium nitride (GaN) versus silicon carbide (SiC) In the High Frequency (RF) and power switching applications’. Available at http://www.digikey.co.uk/Web%20Export/Supplier%20Content/Microsemi_278/PDF/Microsemi_GalliumNitride_VS_SiliconCarbide.pdf?redirected=1, accessed 08 April 2015.
  69. 69)
      • 10. Vas, P., Dury, W.: ‘Electrical machines and drives: present and future’. Proc. of Electrotechnical Conf. (MELECON '96), vol. 1, pp. 67–74.
  70. 70)
      • 26. Wheeler, P., Rodriguez, J., Clare, J., Empringham, L., Weinstein, A.: ‘Matrix converters: a technology review’, IEEE Trans. Ind. Electron., 2002, 49, pp. 276–288 (doi: 10.1109/41.993260).
  71. 71)
      • 144. Bower, G., Rogan, C.P.E., Kozlowski, J., et al: ‘SiC power electronics packaging prognostics’. Aerospace Conf., 2008, pp. 1–12.
  72. 72)
      • 45. ‘Variable speed motor or geared motor’. Available at http://www.leroy-somer.com/documentation_pdf/3415_en.pdf, accessed November 2015.
  73. 73)
      • 78. Bhalla, A., Chow, T.P.: ‘Examination of semiconductors for bipolar power devices’, Inst. Phys. Conf. Ser., 1994, 137, (621), pp. 621–623.
  74. 74)
      • 75. Ozpineci, B., Chinthavali, M.S., Tolbert, L.M.: ‘Enhancing power electronic devices with wide band gap semiconductors’, Int. J. High Speed Electron. Syst., 2006, APA, pp. 545–556 (doi: 10.1142/S0129156406003837).
  75. 75)
      • 191. Chou, B., Beilin, S., Jiang, H., et al: ‘Multilayer high density flex technology’. Proc. 49th Electronic Components and Technology Conf., 1999, pp. 1181–11189.
  76. 76)
      • 120. Chen, H., Cong, T.N., Yang, W., , et al: ‘Progress in electrical energy storage system: a critical review’, Prog. Nat. Sci., 2009, 19, (3), pp. 291–312.
  77. 77)
      • 184. Ji, H., Cheng, X., Chen, H., et al: ‘Direct bonding of alumina substrate with copper heat sink in air assisted by ultrasonic vibrations for high power LEDs devices’. 14th Int. Conf. on Electronic Packaging Technology (ICEPT), August 2013, pp. 1158–1161, 11–14.
  78. 78)
      • 181. R-2188—Technical Data Sheet. Available at http://nusil.com/products/ProductProfiles/R-2188/R-2188P.pdf, accessed 8 April 2015.
  79. 79)
      • 93. van der Duijn Schouten, N.P., Gordon, B.M., McMahon, R.A., et al: ‘Integrated drives as single-phase motor replacement’. Industry Applications Conf., 1999. Thirty-Fourth IAS Annual Meeting. Conf. Record of the IEEE, 1999, vol. 2, pp. 922–928.
  80. 80)
      • 33. ‘UQM and Kinetics present integrated motor and multi-speed transmission for commercial Evs’. Available at https://chargedevs.com/newswire/uqm-and-kinetics-present-integrated-motor-and-multi-speed-transmission-for-commercial-evs/, accessed November 2015.
  81. 81)
      • 42. ‘Getting more from the motor’. Available at http://eandt.theiet.org/magazine/2015/02/efficient-motor-drives.cfm, accessed November 2015.
  82. 82)
      • 58. Şenyıldız, T., Eisele, R., Olesen, K.: ‘Thermal management concepts for power electronic modules’, Danfoss Silicon Power GmbH, 2003, pp. 1–6.
  83. 83)
      • 123. Casady, J.B., Dillard, W.C., Johnson, R.W., et al: ‘A hybrid 6H-SiC temperature sensor operational from 25 C to 500 C’, IEEE Trans. Compon. Packag. Manuf. Technol., 1996, 19, (3), pp. 416–422 (doi: 10.1109/95.536843).
  84. 84)
      • 94. März, M.: ‘Technology choices for automotive applications’. Int. Conf. on Automotive Power Electronics (APE), Paris, 2007.
  85. 85)
      • 141. Mustain, H.A., Lostetter, A.B., Brown, W.D.: ‘Evaluation of gold and aluminium wire bond performance for high temperature (500 °C) silicon carbide (SiC) power modules’. Electronic Components and Technology ECTC, 2005, vol. 2, pp. 1623–1628.
  86. 86)
      • 57. Mantooth, H.A., Mojarradi, M.M., Johnson, R.W.: ‘Emerging capabilities in electronics technologies for extreme environments. Part I - High temperature electronics’, IEEE Power Electron. Soc. Newsl., 2006, 18, (1), pp. 9–14.
  87. 87)
      • 103. Al Ahmar, J., Wiese, S.: ‘Fracture mechanics analysis of cracks in multilayer ceramic capacitors’. Electronics System-Integration Technology Conf. (ESTC), 2014, pp. 1–15.
  88. 88)
      • 133. Horio, M., Iizuka, Y., Ikeda, Y.: ‘Packaging technologies for SiC power modules’, Fuji Electr. Rev., 2012, 58, (2), pp. 75–78.
  89. 89)
      • 115. Klumpner, C., Blaabjerg, F., Thogersen, P.: ‘Converter topologies with low passive components usage for the next generation of integrated motor drives’. Power Electronics Specialist Conf., PESC '03. 2003 IEEE 34th Annual, 2, IEEE., pp. 568–573.
  90. 90)
      • 174. P84 Polyimide Solution—Technical Information. Available at http://hppolymer.com/pdfs/P84-%20Polyimide%20Solution1.pdf, accessed 9 April 2015.
  91. 91)
      • 113. ‘The new high temperature dielectric film for power capacitors’, accessed November 2015. Available at http://www.birkelbachfilm.de/pdf/datenblaetter/DTF_Teonex_HV_0912.pdf.
  92. 92)
      • 107. Bramoulle, M.: ‘Electrolytic or film capacitors’. 33rd IAS Annual Meeting Industry Applications Conf., 1998, vol. 2, pp. 1138–1142.
  93. 93)
      • 105. Kirisken, B., Ugurdag, H.F.: ‘Cost-benefit approach to degradation of electrolytic capacitors’. Reliability and Maintainability Symp., 2014, pp. 1–6.
  94. 94)
      • 59. Liang, Z., Ning, P., Wang, F.: ‘Advanced packaging of sic power module for automotive applications’. Energy Conversion Congress and Exposition (ECCE), IEEE, September 2013, p. 2884, 2891 15–19.
  95. 95)
      • 132. Schupbach, R.M., McPherson, B., McNutt, T., et al: ‘High temperature (250°C) SiC power module for military hybrid electrical vehicle applications’. NDIA Ground Veh. Syst. Eng. Technol. Symp., August 2011, pp. 1–7.
  96. 96)
      • 145. Zhenxian, L.: ‘Packaging technologies to exploit the attributes of WBG power electronics’. IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2014, pp. 1–73.
  97. 97)
      • 185. Chen, L.Y.: ‘Temperature dependent dielectric properties of polycrystalline AlN substrates with yttrium oxide additives’. High Temperature Electronics Conf. HITEC 2006, May 2006.
  98. 98)
      • 73. Shin, M.W., Trew, R.J., Bilbro, G.L.: ‘High temperature DC and RF performance of p-type diamond MESFET: comparison with n-type GaAs MESFET’, IEEE Electron Device Lett., 1994, 15, pp. 292–294 (doi: 10.1109/55.296220).
  99. 99)
      • 194. Liu, X., Xu, S., Lu, G.-Q., et al: ‘Effect of substrate flexibility on solder joint reliability’, Microelectron. Rel., 2002, 42, pp. 1883–1891 (doi: 10.1016/S0026-2714(02)00269-X).
  100. 100)
       • 178. CF-4721—Technical Data Sheet. Available at http://nusil.com/products/ProductProfiles/CF-4721/CF-4721P.pdf, accessed 9 April 2015.
  101. 101)
       • 6. Wang, J., Li, Y., Han, Y.: ‘Evaluation and design for an integrated modular motor drive (IMMD) with GaN devices’. Energy Conversion Congress and Exposition (ECCE), IET, 2013, pp. 4318–4325.
  102. 102)
       • 61. Haque, S., Xing, K., Suchicital, C., et al: ‘Thermal management of high-power electronics modules packaged with interconnected parallel plates’. 14th Annual IEEE Semiconductor Thermal Measurement and Management Symp., SEMI-THERM Proc. 1998, March 1998, p. 111, 119, 10–12.
  103. 103)
       • 47. ‘Lenze smart motor M300’. Available at http://www.lenze.com/fileadmin/lenze/documents/en/catalogue/CAT_MT_MS_13449851_en_GB.pdf, accessed November 2015.
  104. 104)
       • 27. ‘VEMoDRIVE – variable speed drives’. Available at http://www.vem-group.com/fileadmin/content/pdf/Download/Brosch%C3%BCren/Flyer_VEM-motors/28_PB_en.pdf, accessed November 2015.
  105. 105)
       • 82. Chow, T.P., Khemka, V., Fedison, J., et al: ‘SiC and GaN bipolar power devices’, Solid-State Electron., 2000, 44, (2), pp. 277–301 (doi: 10.1016/S0038-1101(99)00235-X).
  106. 106)
       • 161. Bai, J.G., Zhang, Z.Z., Calata, J.N., et al: ‘Low-temperature sintering of nanoscale silver paste: a lead-free die-attach solution for high-performance and high-temperature electronic packaging’. High Temperature Electronics Conf., 2012.
  107. 107)
       • 157. Manikam, V.R., Cheong, K.Y.: ‘Die attach materials for high temperature applications: a review’, IEEE Trans. Compon. Package. Manuf. Technol., 2011, 1, (4), pp. 457–478 (doi: 10.1109/TCPMT.2010.2100432).
  108. 108)
       • 158. Hopkins, D.C., Kellerman, D.W., Wunderlich, R.A., et al: ‘High-temperature, high-density packaging of a 60 kW converter for >200°C embedded operation’. Applied Power Electronics Conf. and Exposition, 2006.
  109. 109)
       • 102. Kim, W., Shin, S.H., Ryu, D.S.: ‘Reliability evaluation and failure analysis for high voltage ceramic capacitor’, Adv. Electron. Mater. Packag., 2001, pp. 286–195.
  110. 110)
       • 81. Chow, T.P., Tyagi, R.: ‘Wide bandgap compound semiconductors for superior high-voltage power devices’, IEEE Trans Electron Devices, 1994, 41, (8), pp. 1481–1483 (doi: 10.1109/16.297751).
  111. 111)
       • 119. Burke, A.: ‘Power sources’, 2000, 91, 37. 2000.
  112. 112)
       • 98. Randall, M., Skamser, D., Kinard, T.: ‘Thin film MLCC’. CARTS 2007 Symp. Proc., Albuquerque, NM, 2007, pp. 1–12.
  113. 113)
       • 15. Zeng, L., Chen, X., Nong, X., et al: ‘FE-based physical model of LPMBDCM for integrated motor drive system analysis’. Third Int. Conf. IEEE Innovative Computing Information and Control, ICICIC '08.2008, p. 581.
  114. 114)
       • 147. Chen, L., Neudeck, P.G.: ‘Thick and thin film materials based chip level packaging for high temperature SiC sensors and devices’, Technical Report, AYT/NASA Glenn Research Center, 2001.
  115. 115)
       • 153. Muralidharan, G., Tiegs, T.N.: ‘Composite die-attach materials for high-temperature packaging applications’. High Temperature Electronics Conf. HITEC, 2006.
  116. 116)
       • 62. Yong, W., Guang, Y., Yong-Kyu, Y., et al: ‘Active cooling substrates for thermal management of microelectronics’, IEEE Trans. Compon. Packag. Technol., 2005, 28, (3), pp. 477–483 (doi: 10.1109/TCAPT.2005.848575).
  117. 117)
       • 67. O'Connor, J., Smiltens, J.: ‘Silicon carbide, a high temperature semiconductor’ (Symp. Publications Division, Pergamon Press, New York, 1960).
  118. 118)
       • 39. Mueller, S.I., Nellis, G.F., Jahns, T.M.: ‘Model and design of an aircooled thermal management system for an integrated motor-controller’. Proc. of 2005 CPES Power Electronics Seminar, pp. 145–152.
  119. 119)
       • 96. Simon, O., Mahlein, J., Muenzer, M.N., et al: ‘Modern solutions for industrial matrix-converter applications’, IEEE Trans. Ind. Electron., 2002, 49, (2), pp. 401–406 (doi: 10.1109/41.993273).
  120. 120)
       • 71. v.Muench, M., Hoeck, P., Pettenpaul, E.: ‘IEEE Int. Electron Device Mtg. Technical Digest 337 1977.
  121. 121)
       • 10. Haghbin, S., Khan, K., Zhao, S., Alakula, M., Lundmark, S., Carlson, O.: ‘An integrated 20-kW motor drive and isolated battery charger for plug-in vehicles’, IEEE Trans. Power Electron., 2013, 28, (8), pp. 4013–4029 (doi: 10.1109/TPEL.2012.2230274).
  122. 122)
       • 202. Jain, P.K.: ‘Power electronics for low voltage semiconductor technology: challenges and some possible solutions’. Power Electronics and Motion Control Conf., IPEMC 2004. The 4th International, August 2004, vol. 1, p. 20, 28 14–16.
  123. 123)
       • 203. Kolar, J., Drofenik, U., Biela, J., et al: ‘PWM converter power density barriers’. Power Conversion Conf. – Nagoya, April 2007, PCC '07, pp. 2–5.
  124. 124)
       • 97. Pan, M.J., Randall, C.A.: ‘A brief introduction to ceramic capacitors’, Electr. Insul. Mag., 2010, 26, (3), pp. 44–50 (doi: 10.1109/MEI.2010.5482787).
  125. 125)
       • 84. Trivedi, M., Shenai, K.: ‘High temperature capability of devices on Si and wide bandgap materials’. Industry Applications Conf., IEEE, 1998, vol. 2, pp. 959–962.
  126. 126)
       • 171. Zhang, Z., Bai, J.G., Lu, G.-Q., et al: ‘Low-temperature Sintering Nanoscale Silver Paste as an High-Temperature package Solution’. CPES Conf. and Site Visit, 2005.
  127. 127)
       • 31. Wheeler, P.W., Clare, J.C., Apap, M., et al: ‘An integrated 30 kW matrix converter based induction motor drive’. PESC '05. IEEE 36th Power Electronics Specialists Conf., IEEE,. 2005, pp. 2390–2395.
  128. 128)
       • 90. Hudgins, J.L., Simm, G.S., Khan, M.A.: ‘A new assessment of the use of wide bandgap semiconductors and the potential of GaN’. The 33d Annual IEEE Power Electronics Specialists Conf. (PESC02), 2002, pp. 1747–1752.
  129. 129)
       • 37. Fraser, A.: ‘IN-WHEEL ELECTRIC MOTORS - The packaging and integration challenges’. Available at http://www.proteanelectric.com/wp-content/uploads/2013/07/In_Wheel_Electric_Motors_AFraser_ProteanV4.pdf accessed 12 April 2015.
  130. 130)
       • 199. Nawa, K.: ‘Reliability study for CTE mismatching in build-up structure’. 51st Proc. Electronic Components and Technology Conf., 2001, pp. 1154–1158.
  131. 131)
       • 46. ‘MOVIMOT® gearmotor with integrated frequency inverter’. Available at http://www.seweurodrive.com/produkt/movimot-gearmotor-with-integrated-frequency-inverter.htm, accessed November 2015.
  132. 132)
       • 7. Agarwald, S.H., Ryu, S.H., Krishnaswami, S., et al: ‘a review of high power, high temperature SiC devices’. High Temperature Electronics Conf. HITEC 2006, May 2006.
  133. 133)
       • 189. van der Duijn Schouten, N.P., Gordon, B.M., McMahon, R.A., et al: ‘Integrated drives using high voltage power ICs’. Eighth Int. Conf. on Power Electronics and Variable Speed Drives, 2000.(IEE Conf. Publ. No. 475), pp. 554–559.
  134. 134)
       • 30. ‘Siemens Multiple Drive for Vertical Mills’. Available at http://www.industry.siemens.com/drives/global/en/gear-units/application-specific-gear-units/vertical-mills/flender-multiple-drive/pages/default.aspx, accessed November 2015.
  135. 135)
       • 48. Miller, T.J.: ‘Electrical Energy Storage for Vehicles: Targets and Metrics’. Available at http://www.arpa-e.energy.gov/sites/default/files/documents/files/Ford%20Presentation.pdf, accessed November 2015.
  136. 136)
       • 110. Spanik, P., Frivaldsky, M., Kanovsky, A.: ‘Life time of the electrolytic capacitors in power applications’, ELEKTRO, 2014, pp. 233–238.
  137. 137)
       • 51. ‘AXOR fastback’. Available at http://www.motioncontrolproducts.com/pdfs/axor-fast-back-brushless-motor-with-drive.pdf, accessed November 2015.
  138. 138)
       • 180. EPM-2422—Technical Data Sheet. Available at http://www.silicone-polymers.com/pdfMaster/EPM-2422P.pdf, accessed 9 April 2015.
  139. 139)
       • 116. Lewandowski, A., Jakobczyk, P., Galinski, M., et al: ‘Self-discharge of electrochemical double layer capacitors’, Phys. Chem. Chem. Phys., 2013, 22, (15), pp. 8692–8699 (doi: 10.1039/c3cp44612c).
  140. 140)
       • 26. ‘Danfoss VLT DriveMotor FCM 300’. Available at http://www.danfoss.com/NR/rdonlyres/40FA1C95-CFB6-4BA1-A69D-D36F61436B59/0/FCM300_FactSheet_PF009A02.pdf, accessed November 2015.
  141. 141)
       • 50. INMOCO. Available at http://www.inmoco.co.uk/pegasus_integrated_servo_system, accessed November 2015.
  142. 142)
       • 114. Caliari, L., Bettacchi, P., Boni, E., et al: ‘KEMET film capacitors for high temperature, high voltage and high current’. CARTS Int. Proc.– ECA, 2013.
  143. 143)
       • 165. Wu, M., Lu, G.-Q., Yin, J., et al: ‘Thermal modelling and electrical analysis of the nano-silver paste die-attached power device package at high temperature’. CPES Conf. and Site Visit, 2006.
  144. 144)
       • 49. ‘Alpha step series’. Available at http://www.orientalmotor.com/products/stepper-motors/ASX-series-all-in-one-stepper-motor.html, accessed November 2015.
  145. 145)
       • 118. Wang, G., Zhang, L., Zhang, J.: ‘A review of electrode materials for electrochemical supercapacitors’, Chem. Soc. Rev., 2012, 2, (41), pp. 797–828 (doi: 10.1039/C1CS15060J).
  146. 146)
       • 109. Maddula, S.K., Balda, J.C.: ‘Lifetime of electrolytic capacitors in regenerative induction motor drives’. Power Electronics Specialists Conf., 2005, pp. 153–159.
  147. 147)
       • 131. Mitsubishi SiC Power modules. Available at http://www.mitsubishielectric.com/semiconductors/catalog/pdf/SiCPowerModules_E_201409.pdf Accessed Apr 08, 2015.
  148. 148)
       • 83. Mishra, U.: ‘Compound semiconductors; GaN and SiC, separating fact from fiction in both research and business’. Available at http://www.apec-conf.org/wp-content/uploads/2014/01/2_APEC2013Plenary_Compound_Semiconductors_GaN__SiC_Mishra_Transphorm.pdf, accessed 10 April 2015.
  149. 149)
       • 29. ‘Lenze Inverter Drives 8400 motec’. Available at http://www.actechdrives.com/PDF/Lenze/Lenze-8400-Motec-Inverters.pdf, accessed November 2015.
  150. 150)
       • 14. Mohammed, O.A., Liu, S., Liu, Z.: ‘Physical modelling of pm synchronous motors for integrated coupling with machine drives’, IEEE Trans. Magn., IEEE, 2005, 41, (5), pp. 1628–1631 (doi: 10.1109/TMAG.2005.846122).
  151. 151)
       • 43. ‘Grundfoss E-pumps’. Available at https://us.grundfos.com/content/dam/GPU/Literature/LCSE-LFE/LCBSSL04-0614-Grundfos-E-Pump-Brochure.pdf, accessed November 2015.
  152. 152)
       • 23. Shakweh, Y., Owen, G.H., Hall, D.J., et al;: ‘Plug and play integrated motor drives’. Proc. of IEE Power Electronics, Machines and Drives Conf. (PEMD'02), 2002, pp. 655–661.
  153. 153)
       • 99. Takamizawa, H., Utsumi, K., Yonezawa, M., et al: ‘Large capacitance multilayer ceramic capacitor’, IEEE Trans. Compon. Hybrids Manuf. Technol., 1981, 4, (4), pp. 345–349 (doi: 10.1109/TCHMT.1981.1135828).
  154. 154)
       • 197. Savrun, E.: ‘Packaging considerations for very high temperature Microsystems’, Proc. IEEE, 2002, 2, (6), pp. 1139–1143 (doi: 10.1109/ICSENS.2002.1037274).
  155. 155)
       • 154. Jacob, P., Held, M., Sacco, P., et al: ‘Reliability testing and analysis of IGBT power semiconductor modules’, IEEE Colloquim IGBT Propulsion Drives, 1995, pp. 4/1–4/5.
  156. 156)
       • 152. Bai John, G., Lu, G.-Q., Xingsheng, L.: ‘Flip-chip on flex integrated power electronics modules for high-density power integration’, IEEE Trans. Adv. Packag., 2003, 26, (1), pp. 54–59 (doi: 10.1109/TADVP.2003.811367).
  157. 157)
       • 12. Nie, Z., Emadi, A.: ‘Integrated converters for switched reluctance motor drives’. Power Electronics and Motion Control Conf., 2004. IPEMC, 2004, vol. 2, pp. 487–490.
  158. 158)
       • 143. Jian, Y., Zhenxian, L., van Wyk, J.D.: ‘High temperature embedded SiC chip module (ECM) for power electronics applications’, IEEE Trans. Power Electron., 2007, 22, (2), pp. 392–398 (doi: 10.1109/TPEL.2006.889901).
  159. 159)
       • 63. Ozpineci, B., Tolbert, L.M., Islam, S.K., et al: ‘Testing, characterization and modelling of SiC diodes for transportation applications’. IEEE Power Electronics Specialists Conf. IEEE.2002, pp. 1673–1678.
  160. 160)
       • 139. Kodani, K., Tsukinari, T., Matsumoto, T.: ‘New power module concept by forced-air cooling system for power converter’. Int. Power Electronics Conf. (IPEC), June 2010, p. 542, 545, 21–24.
  161. 161)
       • 172. Cyclotene* 3000 Series—Processing Procedures for CYCLOTENE 3000 Series Dry Etch Resins. Available at http://msdssearch.dow.com/PublishedLiteratureDOWCOM/dh_08b4/0901b803808b4ed7.pdf?filepath=/888-00006.pdf&fromPage=GetDoc, accessed April 8, 2015.
  162. 162)
       • 164. Lu, G.-Q., Calata, J.N., Zhang, Z., et al: ‘A lead-free, low-temperature sintering die-attach technique for high-performance and high temperature packaging’. IEEE CPMT Conf. on High Density Microsystem Design and Packaging and Component Failure Analysis HDP, 2004, pp. 42–46.
  163. 163)
       • 128. Savrun, E.: ‘Packaging considerations for very high temperature microsystems’. Proc. 1st IEEE Sens., 2002, vol. 2, pp. 1139–1143.
  164. 164)
       • 162. Chih, P.W., Mesa, B.J.A., Hong, X., et al: ‘Application and high temperature storage test on Zn-Al-Ge high temperature solder for die attach’. 2014 IEEE 16th Electronics Packaging Technology Conf. (EPTC), 3–5 December 2014, vol., no., pp. 463–468.
  165. 165)
       • 77. Shenai, K., Scott, R.S., Baliga, B.J.: ‘Optimum semiconductors for high power electronics’, IEEE Trans. Electron Devices, 1989, 36, (9), pp. 1811–182 (doi: 10.1109/16.34247).
  166. 166)
       • 41. ‘Baldor SmartMotor’. Available at http://www.baldor.com/Shared/manuals/750-902.pdf, accessed November 2015.
  167. 167)
       • 196. Stockmeier, T., Beckedahl, P., Gobl, C., et al: ‘SKiN: Double side sintering technology for new packages’. ISPSD, 2011.
  168. 168)
       • 22. Biswas, P.S., Das, N., Biswas, S.K.: ‘Design consideration of an integrated induction motor drive to replace auxiliary dc motors in locomotives’. Int. Conf. on Power Electronics and Drives Systems IEEE.2005, vol. 2, pp. 872–875.
  169. 169)
       • 121. Lambert, S.M., Pickert, V., Holden, J., et al: ‘Comparison of supercapacitor and lithium-ion capacitor technologies for power electronics applications’. Fifth IET Int. Conf. on Power Electronics, Machines and Drives (PEMD 2010), April 2010, p. 1,5, 19–21.
  170. 170)
       • 129. Das, M.K., Sumakeris, J.J., Hull, B.A., et al: ‘Drift-free, 50 A, 10 kV 4H-SiC pin diodes with improved device yields’, Mater. Sci. Forum, 2005, 483–485, pp. 965–968 (doi: 10.4028/www.scientific.net/MSF.483-485.965).
  171. 171)
       • 3. Viorel, I.A., Szabo, L., Ciorba, R.C.: ‘Integrated motor and control unit for industrial variable speed drive’. Available at http://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.301.2182&rep=rep1&type=pdf accessed November 2015.
  172. 172)
       • 100. Yano Research Institute: ‘Capacitor market in japan: key research findings 2009’ (Yano Research Institute, Tokyo, Japan, 2009).
  173. 173)
       • 106. Deshpande, R.P.: ‘Capacitors: technology and trends’ (Tata McGraw-Hill Education, 2012).
  174. 174)
       • 138. Yiying, Y., Guo-Quan, L., Boroyevich, D., et al: ‘Survey of high-temperature polymeric encapsulants for power electronics packaging’, IEEE Trans. Compon. Packag. Manuf. Technol., 2015, 5, (2), pp. 168–181 (doi: 10.1109/TCPMT.2014.2337300).
  175. 175)
       • 3. Pearton, S.J., Zopler, J.C., Shurl, R.J., Ren, F.: ‘GaN: processing, defects, and devices’, J. Appl. Phys., 1999, 86, (1), pp. 1–78 (doi: 10.1063/1.371145).
  176. 176)
       • 182. Scofield, J.D., Merrett, J.N., Richmond, J., et al: ‘Performance and reliability characteristics of 1200 V, 100 A, 200°C half-bridge SiC MOSFET-JBS diode power modules’. Proc. Int. Conf. High Temperature Electron. (HiTEC), Albuquerque, NM, USA, May 2010.
  177. 177)
       • 173. Cyclotene* 4000 Series—Processing Procedures for CYCLOTENE 4000 Series Resins-DS3000 Immersion Develop Process. Available at http://msdssearch.dow.com/PublishedLiteratureDOWCOM/dh_08b4/0901b803808b4eda.pdf?filepath=/888-00008.pdf&fromPage=GetDoc. Accessed 9 April 2015.
  178. 178)
       • 188. Beica, R.: ‘Flip chip market and technology trends’. 2013 European Microelectronics Packaging Conf. (EMPC), September 2013, p. 1, 4, 9–12.
  179. 179)
       • 2. Bartos, F.J.: ‘Integrated motor-drives seek wider market, user acceptance’, Control Eng., 2000, 47, (13), pp. 19–23.
  180. 180)
       • 55. Stolpa, S.: ‘Turbulent heat transfer’. Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, USA, April 2004.
  181. 181)
       • 150. Lu, C.: ‘Review on silver wire bonding’. Microsystems, Packaging, Assembly and Circuits Technology Conf. (IMPACT), 2013 Eighth Int., 22–25 October 2013, vol., no., pp. 226–229.
  182. 182)
       • 127. Lei, T.G., Calata, J.N., Luo, S., et al: ‘Low temperature sintering of nanoscale silver paste for attaching large-area (>100 mm2) chips’, IEEE Trans. Comp. Package. Technol., 2010, 33, (1), pp. 98–104 (doi: 10.1109/TCAPT.2009.2021256).
  183. 183)
       • 89. Dang, G.T., Zhang, A.P., Pen, F., et al: ‘High-voltage GaN Schottky rectifiers’, IEEE Trans. Electron Devices, 2002, 47, (4), pp. 692–696 (doi: 10.1109/16.830981).
  184. 184)
       • 117. Becker, H.I., U.S. pat., 2800.616 to General Electric Co., 1957.
  185. 185)
       • 72. Ebert, W., Vescan, A., Borst, T.H., et al: ‘IEEE Intl. Electron Device Mtg. Technical Digest 419 1994.
  186. 186)
       • 34. ‘Bonfiglioli 600D - Electric powertrains for lightweight vehicles’. Available at http://www.bonfiglioli.co.uk/en-gb/mobile/products/electric-solutions/powertrains/product/600d-electric-powertrain/, accessed November 2015.
  187. 187)
       • 16. Klumpner, C., Nielsen, P., Boldea, I., et al: ‘A new matrix converter motor (MCM) for industry applications’, IEEE Trans. Ind. Electron., 2002, 49, pp. 325–335 (doi: 10.1109/41.993265).
  188. 188)
       • 18. Haghbin, S., Thiringer, T., Carlson, O.: ‘An integrated split-phase dual-inverter permanent magnet motor drive and battery charger for grid-connected electric or hybrid vehicles’. 20th Int. Conf. on Electrical Machines (ICEM). IEEE., 2012, pp. 1941–1947.
  189. 189)
       • 36. Henze, M.: ‘The Integral Motor – a new variable-speed motor drive’. Available at https://library.e.abb.com/public/82be3ed09497afb3c1256ddd00346fb6/04-08m181.pdf, accessed November 2015.
  190. 190)
       • 40. ‘Integrated IE4 motor-drive is 'up to 40% smaller' Yaskawa 4 kW. Available at http://en.ofweek.com/new-products/Integrated-IE4-motor-drive-is-up-to-40-smaller-23406, accessed November 2015.
  191. 191)
       • 86. Extance, A.: ‘SiC and GaN power devices jostle to grow their role’, Yole Development, Issue 9, 2013. Available at http://www.yole.fr/iso_upload/mag/powerdev_april2013_ir.pdf 09 Apr, 2015.
  192. 192)
       • 195. Bivragh, M., Kelley, M., Van Sinte Jans, J.-B., et al: ‘Thermo-mechanical modelling and thermal performance characterisation of a 3D folded flex module’.  Proc. 56th Electronic Components and Technology Conf. , 2006. 30May 2006–2 June 2006, vol., no., p. 6.
  193. 193)
       • 68. Hudgins, J.L., Simin, G.S., Khan, M.A.: ‘A new assessment of the use of wide bandgap semiconductors and the potential for GaN’. Power Electronics Specialists Conf., 2002, vol. 4, pp. 1747–1752.
  194. 194)
       • 134. Chen, Z., Yao, Y., Boroyevich, D., et al: ‘A 1200 V, 60 A SiC MOSFET multi-chip phase-leg module for high-temperature, high-frequency applications’. Applied Power Electronics Conf. and Exposition (APEC), 28th Annual IEEE, 2013, pp. 608–615.
  195. 195)
       • 137. Yao, Y., Chen, Z., Lu, G.-Q.: ‘Characterization of encapsulants for high-voltage high-temperature power electronic packaging’, IEEE Trans. Compon. Packag. Manuf. Technol., 2012, 2, (4), pp. 539–547 (doi: 10.1109/TCPMT.2011.2173344).
  196. 196)
       • 79. Bhalla, A., Chow, T.P.: ‘Bipolar power device performance: dependence on materials, lifetime and device ratings’. Proc. Sixth Int. Symp. on Power Semiconductor Devices and ICs, 1994, pp. 287–292.
  197. 197)
       • 101. Phillips, R., Bultitude, J., Gurav, A., et al: ‘High temperature ceramic capacitors for deep well applications’. CARTS Int. Proc., 2013.
  198. 198)
       • 159. Humpston, G., Jacobson, D.M.: ‘Principles of Soldering’, ASM International, 2004.
  199. 199)
       • 54. Hearn, J.A.: ‘Future packaging technologies for hybrid electronics in automotive underhood environment’. Proc. 1989 High Temperature Electronics Conf., 1989.
  200. 200)
       • 198. Sugawara, Y., Takayama, D., Asano, K.: ‘3 kV 600 a 4H-SiC high temperature diode module’. Proc. Power Semicond. Devices ICs, 2002, pp. 245–248.
  201. 201)
       • 19. Pickering, S., Thovex, F., Wheeler, P., et al: ‘Thermal design of an integrated motor drive’. IECON 2006–32nd Annual Conf. on Industrial Electronics IEEE, pp. 4794–4799.
  202. 202)
       • 192. Woo, D.R.M., Hwang, H.Y., Li, J.A.J., et al: ‘High power SiC inverter module packaging solutions for junction temperature over 220°C’. IEEE 16th Electronics Packaging Technology Conf. (EPTC), December 2014, p. 31, 35, 3–5.