access icon free Yield modelling and analysis of bundled data and ring-oscillator based designs

The ill effects of process, voltage, and temperature variations are significantly reduced by ring-oscillator (OR)-based clocks and bundled-data (BD) designs. Such designs include delay lines that enable the addition of test margin that can either by set uniformly across all manufactured chips or tuned individually per-chip. This study mathematically analyses the resulting yield subject to a limit on shipped product quality providing a practical mechanism of optimising the test margins for these circuits. The model also provides a means of quantifying the benefits from the correlation in the delay line and combinational logic. In particular, using correlation values obtained from Monte Carlo analysis of a sample circuit in a 65 nm process, the model shows that BD and OR-based circuits can have an over 50% yield advantage over their synchronous counterparts.

Inspec keywords: delay lines; integrated circuit testing; combinational circuits; integrated circuit design; Monte Carlo methods; clocks; integrated circuit yield; logic gates; mathematical analysis

Other keywords: bundled data; OR-based circuits; process-voltage-temperature variations; bundled-data designs; combinational logic; delay line; ring-oscillator; Monte Carlo analysis; mathematical analysis; size 65.0 nm; OR-based clocks; shipped product quality

Subjects: Mathematical analysis; Pulse circuits; Logic and switching circuits; Monte Carlo methods; Mathematical analysis; Digital circuit design, modelling and testing; Monte Carlo methods; Logic circuits; Other digital circuits

http://iet.metastore.ingenta.com/content/journals/10.1049/iet-cdt.2018.5040
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content/journals/10.1049/iet-cdt.2018.5040
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