http://iet.metastore.ingenta.com
1887

Three-dimensional integrated circuits implementation of multiple applications emphasising manufacture reuse

Three-dimensional integrated circuits implementation of multiple applications emphasising manufacture reuse

For access to this article, please select a purchase option:

Buy article PDF
$19.95
(plus tax if applicable)
Buy Knowledge Pack
10 articles for $120.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
IET Computers & Digital Techniques — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

The authors propose a platform-based approach called Chipsburger for three-dimensional integrated circuits (3D IC) implementation of multiple electronics systems. The authors emphasise manufacturing reuse to lower the total non-recurring engineering and mass-production cost of 3D chips for multiple applications. Given a set of applications each employing a set of IPs and needing a certain amount of mass-production volume, the author's target 3D IC stack consists of platform dies and customised dies. Platform dies can be manufactured in large volume at low unit cost and used in multiple applications; Customised dies for individual application, on the other hand, will be smaller and easier to implement, as certain functionality has been allocated to the platform dies. The authors have developed a 3D IC cost model to evaluate platform-die configurations and compare the cost benefit of Chipsburger with that of either one 2D system-on-a-chip or 3D IC per application. The authors also develop a platform generator program for finding an optimised platform for a set of applications. Experimental results over industrial examples indicate that Chipsburger is indeed cost-effective for certain range of volume requirements.

References

    1. 1)
    2. 2)
    3. 3)
      • Mercier, P., Singh, S., Iniewski, K., Moore, B., O'Shea, P.: `Yield and cost modelling for 3D chip stack technologies', Proc. IEEE Int. Conf. on Custom Integrated Circuits Conf., September 2006, San Jose, CA, USA, p. 357–360.
    4. 4)
      • Liu, C., Chen, J.-H., Manohar, R., Tiwari, S.: `Mapping system-on-chip designs from 2-D to 3-D ICs', Proc. IEEE Int. Symp. on Circuits and Systems, May 2005, Kobe, Japan, 3, p. 2939–2942.
    5. 5)
      • Weerasekera, R., Zheng, L.-R., Pamunuwa, D., Tenhunen, H.: `Extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs', Proc. IEEE/ACM Int. Conf. on Computer-Aided Design, November 2007, San Jose, CA, USA, p. 212–219.
    6. 6)
      • Dong, X., Xie, Y.: `System-level cost analysis and design exploration for three-dimensional integrated circuits (3D ICs)', Proc. IEEE Int. Conf. on Asia and South Pacific Design Automation Conf., January 2009, Yokohama, Japan, p. 234–241.
    7. 7)
      • J.M. Rabaey , A. Chandrakasan , B. Nikolic . (2003) Digital integrated circuits – a design perspective.
    8. 8)
      • Hsieh, A.-C., Hwang, T.T.: `TSV redundancy: architecture and design issues in 3D IC', Proc. IEEE Int. Conf. on Design Autoamtion and Test in Europe, March 2010, Dresden, Germany.
    9. 9)
    10. 10)
    11. 11)
      • Salam, A., Bhuiyan, N.F., Gouw, G.J., Raza, S.A.: `Estimating design effort in product development: a case study at Pratt & Whitney Canada', Proc. IEEE Int. Conf. on Industrial Engineering and Engineering Management, December 2007, Singapore, p. 989–993.
    12. 12)
    13. 13)
http://iet.metastore.ingenta.com/content/journals/10.1049/iet-cdt.2009.0118
Loading

Related content

content/journals/10.1049/iet-cdt.2009.0118
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
This is a required field
Please enter a valid email address