Fabrication and characterisation of high-performance and high-current back-gate thin-film field-effect transistors using sorted single-walled carbon nanotubes

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Fabrication and characterisation of high-performance and high-current back-gate thin-film field-effect transistors using sorted single-walled carbon nanotubes

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The authors present the wafer scale fabrication and characteristics of back-gate semiconducting carbon nanotube thin-film field-effect transistors (SN-TFTs) suitable for high-current applications. Good on–off current ratio TFTs using affordable 95% purity semiconducting tubes by appropriately choosing the length of the nanotubes and improving the nanotube density have been demonstrated. Moreover, the nanotube thin-film deposition is carried out using a simple solution-based assembly method and good TFT performance and high currents are achieved with random-oriented network of nanotubes. Hafnium oxide (HfOx) is used as the gate dielectric material to improve the device performance. The global gate devices have shown an excellent p-type behaviour with a low output conductance value of 0.3 µS. The SN-TFTs have exhibited a maximum on–off ratio of 4×104 at lower operating gate voltages, a maximum on-current of 3.1 mA at a current density of 6.2 µA/µm, a steep sub-threshold slope of 600 mV/decade, threshold voltage of −1.5 V, a maximum normalised transconductance of 0.7 µS/µm and a maximum carrier mobility of 44.2 cm2/V s.

Inspec keywords: dielectric materials; hafnium compounds; nanotechnology; insulated gate field effect transistors; carbon nanotubes; thin film transistors

Other keywords: high current application; solution based assembly method; voltage 1.5 V; gate dielectric material; sorted single walled carbon nanotubes; semiconducting tube; wafer scale fabrication; back gate thin film field effect transistors; HfOx

Subjects: Insulated gate field effect transistors; Nanometre-scale semiconductor fabrication technology; Fullerene, nanotube and related devices

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