Bountiful baseband [smartphones]

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Bountiful baseband [smartphones]

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The uptake of smartphones is driving rapid innovation in the chips that enable them. At the low end, handset makers want affordable devices for emerging markets. At the high end, demand for advanced features such as 3D HD playback is seeing chipmakers push manufacturing processes to the limit. Meanwhile, there have been key advances in the air interface and control of the modem design.

Inspec keywords: telecommunication computing; user interfaces; telecommunication industry; design engineering; microprocessor chips; mobile computing; mobile handsets; innovation management

Other keywords: handset makers; affordable devices; rapid innovation; manufacturing processes; smartphones; modern design; chips; advanced features; chipmakers; bountiful baseband; emerging markets; 3D HD playback; air interface

Subjects: Project and design engineering; Microprocessor chips; Administration and management; Mobile radio systems; Communications equipment manufacturing; User interfaces; Design; Microprocessors and microcomputers; Communications computing; Mobile, ubiquitous and pervasive computing; Research and development; Industrial applications of IT

http://iet.metastore.ingenta.com/content/journals/10.1049/et.2011.0410
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