© The Institution of Engineering and Technology
Low temperature deposition, by sputtering, on flexible/plastic substrates offers a relatively cheap alternative for fabricating single-/multilayer thin film devices. However, sputtering yields amorphous material, with low electrical conductivity, and requires subsequent annealing. Demonstrated is a new method of crystallisation, where controlled application of electrical pulses to sputter deposited Si/Si0.8Ge0.2 multilayers is shown to decrease the electrical resistance by as much as 80%.
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http://iet.metastore.ingenta.com/content/journals/10.1049/el_20081544
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