1.2 V NOR Flash memory in system-in-package

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1.2 V NOR Flash memory in system-in-package

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A NOR Flash memory system, the supply voltage of which can be as low as 1.2 V, is described. The internal memory chip supply voltage (1.8 V) is obtained by means of a DC-DC converter totally included in the same package of the memory. This system represents a way to overcome technology limitations to generate a Flash device supplied at a voltage close to 1 V and below. The NOR Flash memory system is assembled in a ball grid array 88 balls 14×8×1.6 mm, with the same ballout of the standard Flash memory working at 1.8 V.

Inspec keywords: flash memories; DC-DC power convertors; system-in-package; NOR circuits; ball grid arrays

Other keywords: NOR flash memory; system-in-package; 8 mm; 1 V; DC-DC converter; ball grid array; internal memory chip; 1.8 V; flash device; 14 mm; 1.2 V; 1.6 mm

Subjects: Power electronics, supply and supervisory circuits; Product packaging; Memory circuits; Logic and switching circuits; Semiconductor storage; Logic circuits

References

    1. 1)
      • D.A. Doane , P.D. Franzon . (1993) Multichip module technologies and alternatives.
    2. 2)
      • I. Abraham . (1977) Switching and linear power supply, power converter design.
    3. 3)
      • Ripamonti, G., Bertolaccini, M., Peritore, R., Schippers, S.: `Low power–low voltage band gap references for flash-EEPROM integrated circuits: design alternatives and experiments', Proc. of Electronics, Circuits and Systems (ICECS '99), September 1999, 2, p. 635–638.
    4. 4)
    5. 5)
      • W.D. Brown . (1999) Advanced electronic packaging.
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