Polymer encapsulated miniature Nd:YAG lasers

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Polymer encapsulated miniature Nd:YAG lasers

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A continuation of the previously introduced microstructured silicon carrier concept for diode-pumped solid-state lasers is presented, using novel heat-conducting polymers as a carrier. The most prominent features of the silicon carrier concept are maintained, adding to the mass production possibilities of the inexpensive polymers. The first experiments, using a continuous wave Nd:YAG microchip laser, have given an output power of 2 W at 1064 nm, showing the potential of this new approach.

Inspec keywords: thermal management (packaging); yttrium compounds; garnets; optical pumping; microchip lasers; encapsulation; neodymium

Other keywords: mass production; YAG:Nd; heat-conducting polymers; YAl5O12:Nd; miniature Nd:YAG lasers; microchip laser; 1064 nm; microstructured silicon carrier; diode-pumped solid-state lasers; 2 W

Subjects: Product packaging; Design of specific laser systems; Solid lasers; Optoelectronics manufacturing; Lasing action in other solids; Packaging

References

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      • Å. Claesson , J. Holm , R. Koch , M. Olson , A. Olsson , C. Vieider , H. Åhlfeldt , F. Laurell . Diode-pumped miniature lasers using microstructured silicon carriers. Electron. Lett. , 5 , 443 - 444
    2. 2)
      • T.Y. Fan , R.L. Byer . Diode laser-pumped solid-state lasers. IEEE J. Quantum Electron. , 6 , 895 - 912
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      • A.E. Siegman . Analysis of laser beam quality degradation caused by quartic phase aberrations. Applied Opt. , 30 , 5893 - 5901
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      • Freitas, B.L., Skidmore, J.A., Crawford, J., Satariano, J., Utterback, E., Dimercurio, L., Cutter, K., Kanz, K., Sutton, S., Beach, R.J.: `Laser diode array packages in silicon using V-groove technology', Trends in Optics and Photonics, Advanced Solid-State Lasers Conference, 2001, 50, p. 47–49.
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