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Integration of microstrip antenna on cavity-down ceramic ball grid array package

Integration of microstrip antenna on cavity-down ceramic ball grid array package

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The integration of a microstrip antenna on a thin 17×17×2 mm cavity-down ceramic ball grid array package is reported. The antenna, intended for use in either single-chip or single-package wireless transceivers, has achieved an impedance bandwidth of 1.25% and gain of 4.6 dBi at 5.15 GHz.

References

    1. 1)
      • H. Samavali , H.R. Rategh , T.H. Lee . A 5-GHz CMOS wireless LAN receiver front end. IEEE J. Solid-State Circuits , 5 , 765 - 772
    2. 2)
      • S. Donnay , P. Pieters , K. Vaesen , W. Diels , P. Wambacq , W.D. Raedt , E. Beyne , M. Engels , I. Bolsens . Chip-package codesign of a low-power 5-GHz RF front end. Proc. IEEE , 10 , 1583 - 1597
    3. 3)
      • Y.P. Zhang . Integration of microstrip antenna on ceramic ball grid array package. Electron. Lett. , 5 , 207 - 208
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