Your browser does not support JavaScript!
http://iet.metastore.ingenta.com
1887

Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter

Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter

For access to this article, please select a purchase option:

Buy article PDF
£12.50
(plus tax if applicable)
Add to cart
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)
Add to cart

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

  • Author(s): Yong-Ju Kim 1 ; Jae-Kyung Wee 2 ; Young-Hee Kim 3 ; Seongsoo Lee 4
    • View affiliations
    • Affiliations: 1: Memory Research & Development Division, Hynix Semiconductor Inc., Ichon, Korea
      2: College of Information and Electronics Engineering, Hallym University, Chuncheon, Korea
      3: Department of Electronics Engineering, Changwon National University, Changwon, Korea
      4: Department of Information Electronics Engineering, Ewha Womans University, Seodaemun-gu, Korea
  • Source: Volume 38, Issue 17, 15 August 2002, p. 969 – 970
    DOI:  10.1049/el:20020683 , Print ISSN 0013-5194, Online ISSN 1350-911X
© IEE
Published

A modified technique for extracting the electrical parameters of transmission line on PCBs is proposed. It exploits hybrid measurements of the time domain and frequency domain response and does not require complicated and erroneous procedures such as DC capacitance measurement and parameter de-embedding. Experimental results show that the proposed method is more accurate than conventional methods.

Inspec keywords: interconnections; printed circuit testing; electric variables measurement; transmission line theory; S-parameters; time-domain reflectometry

Other keywords: S-parameters; interconnection parameter extraction; transmission lines; electrical parameters; hybrid measurements; time domain response; frequency domain response; printed circuit board; PCBs; time domain reflectometry

Subjects: Transmission line theory; Printed circuits; Other electric variables measurement

References

    1. 1)
      • Winkel, T.M., Dutta, L.S., Grabinski, H.: `An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements', Proc. IEEE Multi-Chip Module Conf., 1996, p. 190–195.
    2. 2)
    3. 3)
    4. 4)
      • S.L. Michael . Comparison of method for determining the capacitance of planar transmission lines with application to multichip module characterization. IEEE Trans. Compon. Hybrids Manuf. Technol. , 3 , 247 - 251
    5. 5)
      • Kim, M.J., Ryu, W., Heon, Y.-D., Lee, J., Kim, J., Paik, K.-W.: `Microwave model of an isotropic conductive adhesive flip-chip interconnections for high frequency applications', Proc. IEEE Electron. Components Technol. Conf., 1999, p. 488–492.
    6. 6)
      • Mark, R.B., Williams, D.F.: `Interconnection transmission line parameter characterization', 40thARFTG Conference Digest, 1992, p. 88–95.
http://iet.metastore.ingenta.com/content/journals/10.1049/el_20020683
Loading

Related content

content/journals/10.1049/el_20020683
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading
Print this page
This is a required field
Please enter a valid email address