Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity

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Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity

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For the first time in electro-thermal device and circuit simulation, thermal nonlinearity due to temperature dependent diffusivity is fully treated. It is shown that transformation of the time variable must be employed, in combination with the well-known Kirchhoff transformation for temperature-dependent conductivity to solve accurately the time-dependent heat diffusion equation.

Inspec keywords: thermal diffusivity; integrated circuit modelling; transforms; semiconductor device models

Other keywords: time-dependent heat diffusion equation; circuit simulation; temperature-dependent conductivity; temperature dependent diffusivity; time variable; Kirchhoff transformation; thermal nonlinearity; electro-thermal device simulation

Subjects: Semiconductor integrated circuit design, layout, modelling and testing; Semiconductor device modelling, equivalent circuits, design and testing; Integral transforms in numerical analysis; Integral transforms

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      • Batty, W., Christoffersen, C.E., David, S., Panks, A.J., Johnson, R.G., Snowden, C.M.: `Steady-state and transient elecro-thermal simulation of power devicesand circuits based on afully physical thermal model', THERMINIC 2000, September 2000, Budapest.
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