Yang, Wen Luh; Wu, Wen-Fa; Liu, Don-Gey; Hung, Tung-Ching; Tseng, Fu Yuan: 'Improving thermal stability of shallow junctions by N<sub>2</sub><sup>+</sup> pre-implantation', Electronics Letters, 1999, 35, (24), p. 2143-2145, DOI: 10.1049/el:19991428
IET Digital Library, https://digital-library.theiet.org/;jsessionid=dpc9cgm7b6m2b.x-iet-live-01content/journals/10.1049/el_19991428