Suppression of reverse-short-channel effect in sub –0.1 µm n-MOSFETs with Sb S/D implantation

Access Full Text

Suppression of reverse-short-channel effect in sub –0.1 µm n-MOSFETs with Sb S/D implantation

For access to this article, please select a purchase option:

Buy article PDF
£12.50
(plus tax if applicable)
Buy Knowledge Pack
10 articles for £75.00
(plus taxes if applicable)

IET members benefit from discounts to all IET publications and free access to E&T Magazine. If you are an IET member, log in to your account and the discounts will automatically be applied.

Learn more about IET membership 

Recommend Title Publication to library

You must fill out fields marked with: *

Librarian details
Name:*
Email:*
Your details
Name:*
Email:*
Department:*
Why are you recommending this title?
Select reason:
 
 
 
 
 
Electronics Letters — Recommend this title to your library

Thank you

Your recommendation has been sent to your librarian.

A study is presented into the reverse-short-channel effect (RSCE) for Sb S/D ion implantation at 10 keV. A high impurity concentration is found to reduce interstitial movement in the channel, which restricts the level RSCE at short-channel lengths. The interstitials can be healed by thermal treatment at 850°C directly after ion implantation, resulting in the suppression of the RSCE.

Inspec keywords: annealing; antimony; doping profiles; MOSFET; interstitials; impurity distribution; ion implantation

Other keywords: short-channel lengths; submicron technology; Si:Sb; ion implantation; n-channel MOSFET; 0.1 micron; n-MOSFETs; 10 keV; channel interstitial movement reduction; impurity concentration; thermal treatment; Sb S/D implantation; 850 C; reverse-short-channel effect; NMOSFET; RSCE suppression

Subjects: Semiconductor doping; Insulated gate field effect transistors; Annealing processes in semiconductor technology

References

    1. 1)
      • M. Tsuno , M. Suga , M. Tanaka , K. Shibahara , M.M. Mattausch , M. Hirose . Physically-basedthreshold voltage determination for MOSFETS of all gatelengths. Submitted for publication
    2. 2)
      • Shibahara, K., Mifuji, M., Kawabata, K., Kugimiya, T., Furumoto, H., Tsuno, M., Yokoyama, S., Nagata, M., Miyazaki, S., Hirose, M.: `Low resistive ultra shallow junction for sub0.1 µm MOSFETs formed by Sb implantation', IEDM Tech. Dig., 1995, p. 579–582.
    3. 3)
      • Nishi, K., Matsuhashi, H., Ochiai, T., Kasai, M., Nishikawa, T.: `Evidence of channel profile modificationdue to implantation damage studied by a new method,and its implication to reverse short channel effects of nMOS-FETs', IEDM Tech. Dig., 1995, p. 993–996, Late News.
    4. 4)
      • Rousseau, P.M., Griffin, P.B., Kuehne, S.C., Plummer, J.D.: `Device implications of enhanced diffusioncaused by the electrical deactivation of arsenic', IEDM Tech. Dig., 1994, p. 861–864.
    5. 5)
      • Crowder, S.W., Rousseau, P.M., Snyder, J.P., Scott, J.A., Griffin, P.B., Plummer, J.D.: `Theeffect of source/drain processing on the reverse short channeleffect of deep sub-micron bulk and SOI nMOSFETs', IEDM Tech. Dig., 1995, p. 427–430.
    6. 6)
      • TMA Inc., `Tsuprem-4 user's manual', 1996.
    7. 7)
      • Tsui, P.G.Y., Tseng, H.H., Orlowski, M., Sun, S.W., Tobin, P.J., Reid, K., Taylor, W.J.: `Suppressionof MOSFET reverse short channel effect by N', IEDM Tech. Dig., 1994, p. 501–504.
    8. 8)
      • Sakamoto, H., Kumashiro, S., Hiroi, M., Hane, M., Matsumoto, H.: `Simulation of reverse shortchannel effects with a consistent point-defect diffusionmodel', Proc. Int. Conf. SISPAD, 1997, p. 137–140.
    9. 9)
      • P.M. Rousseau , S.W. Crowder , P.B. Griffin , J.D. Plummer . Arsenic deactivation enhanced diffusionand the reverse short-channel effect. IEEE Electron Device Lett. , 42 - 44
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19990325
Loading

Related content

content/journals/10.1049/el_19990325
pub_keyword,iet_inspecKeyword,pub_concept
6
6
Loading