A new charge transfer preamplifier scheme is developed for low power and high density DRAMs. It employs a boosting method with a MOSFET capacitor for a high voltage precharge level and a pulse control signal for a charge transfer switch. The new scheme increases the sensing margin and enhances the sensing speed under 1.5 V operation with a small area overhead. It also leads to a wider design window for a charge transfer switch as the supply voltage scales down.
References
-
-
1)
-
J.S. Kim ,
Y.S. Choi ,
H.J. Yoo ,
K.S. Seo
.
A low noise folded bit-line sensing architecture for multi-GbDRAM with ultra high density 6F2 cell.
IEEE J. Solid-State Circuits
,
7 ,
1096 -
1102
-
2)
-
Tsukude, M., Kuge, S., Fujino, T., Arimoto, K.: `A 1.2 V to 3.3 V wide-voltage-range DRAM with0.8 V array operation', ISSCC Dig. Tech. Papers, 1997, p. 66–67.
-
3)
-
Itoh, K., Nakagome, Y., Kimura, S., Watanabe, T.: `Limitations and challenges of multi-gigabitDRAM circuits', IEEE Symp. VLSI Circuits Dig. Tech. Papers, 1996, p. 2–7.
-
4)
-
Heller, L.G.: `Cross-coupled charge-transfer sense amplifier', ISSCC Dig. Tech. Papers, 1979, p. 20–21.
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19981161
Related content
content/journals/10.1049/el_19981161
pub_keyword,iet_inspecKeyword,pub_concept
6
6