Current-accelerated channel hot carrier stress of MOS transistors

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Current-accelerated channel hot carrier stress of MOS transistors

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A channel hot carrier current and the failure rate of n- and p-channel MOS transistors are both increased by one to two orders of magnitude by forward biasing the substrate or source p/n junction. Correlations with the hydrogen-bond-breaking theory give a threshold kinetic energy of 3.06 ± 0.05 eV for interface trap generation by hot carriers.

Inspec keywords: hot carriers; electron traps; semiconductor device reliability; failure analysis; MOSFET

Other keywords: MOS transistors; 3.01 to 3.11 eV; hydrogen-bond-breaking theory; source pin junction; forward biasing; failure rate; current-accelerated channel hot carrier stress; interface trap generation; threshold kinetic energy; substrate pin junction

Subjects: Maintenance and reliability; Reliability; Insulated gate field effect transistors

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