Suppression of boron penetration by using inductive-coupling-nitrogen-plasma in stacked amorphous/polysilicon gate structure

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Suppression of boron penetration by using inductive-coupling-nitrogen-plasma in stacked amorphous/polysilicon gate structure

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A method is introduced for suppressing the penetration of boron for BF2+-implanted pMOS devices with a stacked amorphous/poly-Si (SAP) gate structure. It is shown that after inductive-coupling-nitrogen-plasma (ICNP) treatment, boron diffusion through the thin gate oxide is largely suppressed. As shown from the charge-to-breakdown measurements, the ICNP process will improve the quality of pMOS devices, with Qbd three times higher than for the control samples.

Inspec keywords: diffusion; silicon; boron; ion implantation; amorphous semiconductors; elemental semiconductors; MIS devices

Other keywords: diffusion; BF2+-implantation; stacked amorphous/polysilicon gate; Si:BF2; N2; pMOS device; boron penetration; inductive-coupling-nitrogen-plasma; charge-to-breakdown

Subjects: Metal-insulator-semiconductor structures; Semiconductor doping

References

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