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Small planar packaging system for high-throughput ATM switching systems

Small planar packaging system for high-throughput ATM switching systems

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A small planar packaging (SPP) system is described that can be combined with card-on-board (COB) packaging in ATM switching systems with throughputs of over 40 Gbit/s. Using a newly developed quasicoaxial zero-insertion-force connector, point-to-point 311 Mbit/s of 8 bit parallel signal transmission is achieved in an arbitrary location on the SPP system's shelf. Also 5400 I/O connections in the region of the planar packaging system are made, and thus the SPP system eliminates the I/O pin count limitation. Furthermore, the heat flux of the SPP system is five times higher than that of conventional COB packaging because of its air flow control structure.

References

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      • A. Harada , T. Kishimoto , Y. Kaneko . Air cooling technology for high-power telecommunication systems. NTT R&D , 5 , 557 - 564
    2. 2)
      • A. Harada , Y. Kaneko , O. Ibaraki , K. Nakano . High-density packaging system for digital communication system. NTT R&D , 10 , 193 - 202
    3. 3)
      • Miyaho, K., Hirano, M., Takagi, Y., Shiomoto, K., Takahashi, T.: `An ATM switching system architecture for first generation of broadbandservices', ISS'92, 1992, p. 285–289.
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