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0.2 µm AlSb/InAs HEMTs with 5 V gate breakdown voltage

0.2 µm AlSb/InAs HEMTs with 5 V gate breakdown voltage

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DC and microwave measurements on AlSb/InAs HEMTs with a gate length of 0.2 µm are reported. The reverse gate characteristics exhibit relatively low gate leakage current and gate-drain breakdown voltages as high as 5 V. Equivalent circuit modelling yields an fT of 110 GHz after removal of the gate bonding pad capacitance. The bias dependence of fmax is examined indicating a significant reduction in the unilateral gain due to impact ionisation.

References

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      • Zhou, G., Fischer-Colbrie, A., Harris, J.S.: `I-V kink in InAlAs/InGaAs MODFETs due to weak impact ionization processin theInGaAs channel', Proc. Sixth Int. Conf. on Indium Phosphide and Related Materials, 1994, p. 435–438.
    2. 2)
      • X. Li , K.F. Longenbach , Y. Wang , W.I. Wang . High-breakdown-voltage AlSbAs/InAs n-channel field-effect transistors. IEEE Electron. Device Lett. , 192 - 194
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      • C.R. Bolognesi , E.J. Caine , H. Kroemer . Improved charge control and frequency performance in InAs/AlSb-basedheterostructurefield-effect transistors. IEEE Electron Device Lett. , 16 - 18
    4. 4)
      • J.B. Boos , W. Kruppa , B.V. Shanabrook , D. Park , J.L. Davis , H.B. Dietrich . Impact ionization in high-output conductance region of 0.5 µm AlSb/InAsHEMTs. Electron. Lett. , 1888 - 1890
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19941316
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