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Wireless chip to chip interconnections for murtichip modules using leaky wave antennas

Wireless chip to chip interconnections for murtichip modules using leaky wave antennas

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A novel interchip communication technique for very high speed multichip modules is presented. The feasibility of using a dielectric guide leaky wave antenna integrated on a chip for transmission and reception is discussed. J-band measurements and predictions based on a model developed using the transmission line matrix (TLM) method are compared

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