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Floating gate MOSFET structures were fabricated in a standard 2 μn double-polysilicon CMOS process which requires programming voltages of only 6.5–9V. This considerable reduction in programming voltage is achieved by simultaneously exploiting tunnelling through the interpolysilicon oxide and capacitive geometries whose top poly-layers overlap the edges of the lower poly-layers.
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http://iet.metastore.ingenta.com/content/journals/10.1049/el_19920586
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