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Uniform 8×8 array InGaAs/InP multiquantum well asymmetric Fabry–Perot modulators for flipchip solder bond hybrid optical interconnect

Uniform 8×8 array InGaAs/InP multiquantum well asymmetric Fabry–Perot modulators for flipchip solder bond hybrid optical interconnect

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The first 8×8 arrays of multiquantum well asymmetric Fabry–Perot modulators in the InGaAs/InP material system are reproted. These arrays have optical access through the substrate and are flipchip solder bond assembled for direct connection to silicon integrated circuits for optical interconnect applications. A high degree of uniformity of response is obtained across the array with a mean contrast ratio of 35 dB, with a standard deviation of 0.25 dB. Over a 4×4 mm2 chip the standard deviation of peak operating wavelength of the cavity resonance is 3.3 nm.

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