© The Institution of Electrical Engineers
Using a very thin layer of GaAs (2.1 μm) on Si, we have fabricated GaAs MESFETs, 19 stage ring oscillators, and divide-by-2 frequency dividers with good yield. The MESFETs exhibited a maximum gm of 153 mS/mm. The DCFL 19 stage ring oscillators had a minimum propagation delay of 52ps/gate at a power dissipation of 1.3 mW/gate with a yield of 40%. The divide-by-2 circuits performed the frequency dividing operation up to 1.8 GHz.
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http://iet.metastore.ingenta.com/content/journals/10.1049/el_19880706
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