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Inspec keywords: NAND circuits; logic gates; integrated circuit technology; integrated logic circuits; invertors; CMOS integrated circuits; digital simulation; semiconductor device models

Other keywords: junction temperature; CMOS logic cell switching speed; temperature dependence; average gate delay; capacitively loaded inverters; delineation factor; high temperature operation; 25 to 250 C; gate propagation delay; 4 micron; SPICE2G.6 simulations; thermal characterisation; NAND gates

Subjects: CMOS integrated circuits; Logic circuits; Logic and switching circuits; Semiconductor device modelling, equivalent circuits, design and testing

References

    1. 1)
      • D.J. Dean . (1985) , The thermal design of electronic circuit boards and packages.
    2. 2)
      • Dean, D.J.: `A quick method for calculating temperatures arising from the rear cooled heat source geometries found in microelectronics', Proceedings of Internepcon UK 79, 1979, Brighton, p. 202–205.
    3. 3)
      • W. Nakwaski . Thermal model of laser diode arrays. Electron. Lett. , 1169 - 1170
    4. 4)
      • D.J. Dean . Analysis of heat flow spreading from a strip heat souce. Int. J. Numer. Methods Eng. , 1075 - 1076
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