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Results of incoherent light transient annealing of Mg implants in GaAs are reported and compared to conventional furnace anneals. Transient anneals produced better activations, with an optimum at an annealing temperature of 800°C, due apparently to reduced outdiffusion of Mg into the encapsulating silicon nitride layer.
Inspec keywords: ion implantation; annealing; semiconductor technology; III-V semiconductors; gallium arsenide
Other keywords: reduced outdiffusion; incoherent radiation; incoherent light transient annealing; semiconductors; ion implantation; flash lamp annealing; electrical activation; Si3N4 encapsulating layers; Mg implants; GaAs
Subjects: II-VI and III-V semiconductors; Doping and implantation of impurities; Semiconductor doping