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Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell

Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell

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A new technique, the magnetic field assisted bonding is described for proper encapsulation of a thin-film Cu2S-CdS solar cell. This is made possible by using a thin layer of nickel coating on the substrate as the back-electrode. Results on the dependence of the series resistance, short-circuit current, open-circuit voltage, shunt resistance, diode ideality factor and fill factor on the magnetic field, the time and the temperature of application and coating of the grid are presented and discussed.

References

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      • Iles, P.A.: `A survey of grid technology', Proc. 16th IEEE Photovoltaic Specialists Conference, 1982, San Diego, p. 340–347.
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      • A. Rothwarf . TheCdS/Cu2S solar cell, basic operation and anomalous effects. Sol. Cells , 115 - 140
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