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Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell

Magnetic field assisted bonding of prefabricated grid to a Cu2S-CdS solar cell

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A new technique, the magnetic field assisted bonding is described for proper encapsulation of a thin-film Cu2S-CdS solar cell. This is made possible by using a thin layer of nickel coating on the substrate as the back-electrode. Results on the dependence of the series resistance, short-circuit current, open-circuit voltage, shunt resistance, diode ideality factor and fill factor on the magnetic field, the time and the temperature of application and coating of the grid are presented and discussed.

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      • Bloss, W.H., Arndt, W., Bilger, G., Hewig, G.H., Pfisterer, F., Schock, H.W.: `A fabrication process for Cu', Proc. International Solar Energy Society Silver Jubilee Meeting, 1979, Atlanta.
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