© The Institution of Electrical Engineers
The concentration of boron diffused into silicon from a vapour source is found to be affected by the presence of masking oxide. Both spreading resistance and infra-red free-carrier emission techniques have been used to study the effect, and a decrease of about 15° in carrier concentration is observed close to the oxide-masked edge.
References
-
-
1)
-
S.A. Abbasi ,
A. Brunnschweiler
.
The effect of masking oxide on the diffusion of boron into silicon.
IEE Proc. I, Solid-State & Electron Devices
-
2)
-
S.A. Abbasi ,
A. Brunnschweiler
.
Resolution of spreading-resistance measurements on shallow layers.
Electron. Lett.
,
10 ,
290 -
292
-
3)
-
J.C. White ,
J.G. Smith
.
Observation of carrier densities in silicon devices by infra-red emission.
J. Phys. E
,
817 -
825
-
4)
-
S.A. Abbasi ,
A. Brunnschweiler
.
Correction of spreading resistance data obtained from bevelled shallow junctions.
Electron. Lett.
,
13 ,
507 -
508
-
5)
-
Abbasi, S.A., Brunnschweiler, A.: `The effects of oxide masking on boron deposition', Europhysics Conference Abstracts 4H, ESSDERC, September 1980, York, p. 180–181.
-
6)
-
: `NBS special publication 400-10', Spreading Resistance Symposium, 13–14 June 1974.
http://iet.metastore.ingenta.com/content/journals/10.1049/el_19810405
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