Surface stability of GaAs during tin diffusion

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Surface stability of GaAs during tin diffusion

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Experiments are described in which tin was diffused into GaAs in a closed ampoule. When the ambient arsenic vapour pressure was low the results were not reproducible, and severe deterioration of the surface was observed. Evidence is produced which suggests that both evaporation and condensation occurred during these diffusions. The problem was completely solved by employing a high-vapour pressure of arsenic. It is suggested that a gallium-rich surface is less stable than one which is arsenic-rich.

Inspec keywords: III-V semiconductors; semiconductor doping; gallium arsenide; diffusion in solids; surface structure; tin

Other keywords: GaAs; ambient arsenic vapour pressure; semiconductor doping; surface stability; evaporation; Sn diffusion; condensation

Subjects: Diffusion, migration, and displacement of impurities in solids; Solid surface structure; Semiconductor doping; II-VI and III-V semiconductors; Doping and implantation of impurities

References

    1. 1)
      • M.B. Panish . The system Ga-As-Sn: incorporation of Sn into GaAs. J. Appl. Phys. , 2659 - 2666
    2. 2)
      • B. Tuck , M.H. Badawi . Diffusion of tin in n-type GaAs. J. Phys. D, Appl. Phys. , 2541 - 2552
    3. 3)
      • B. Tuck . (1974) , Introduction to diffusion in semiconductors.
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