Inclusion of conductivity in silicon s.a.w. component design

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Inclusion of conductivity in silicon s.a.w. component design

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© The Institution of Electrical Engineers
Published

An equivalent circuit is described for a surface-acoustic-wave delay line utilising interdigital transducers in a multilayered medium with a conductive silicon substrate. Attention is paid to practical material parameters for the ultimate realisation of the monolithic integration of surface-acoustic-wave and electronic components on the same silicon slice.

Inspec keywords: acoustic surface wave devices; ultrasonic delay lines; equivalent circuits

Other keywords: equivalent circuit; Si SAW component design; monolithic integration; surface acoustic wave delay line; conductivity; multilayered medium; interdigital transducers

Subjects: Ultrasonics, quantum acoustics, and physical effects of sound; Acoustic signal processing; Acoustic wave devices

References

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      • Venema, A.: `Influence of the silicon electrical conductivity and a DC-bias voltage on the excitation of acoustic surface waves in the three-layer substrate CdS-SiO', Proceedings of IEEE ultrasonics symposium, 1975, Los Angeles, Paper Wl.
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      • F.S. Hickernell . Zinc-oxide thin-film surface-wave transducers. Proc. IEEE , 631 - 635
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      • A. Venema , R.F. Humphryes . A model for SAW transduction on silicon. Appl. Phys.
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      • Gerard, H., Wauk, M., Weglein, R.: `Large time bandwidth product microwave delay line', ECON-03852, Technical Report, .
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      • G.S. Kino , R.S. Wagers . Theory of interdigital couplers on non-piezoelectric substrates. J. Appl. Phys. , 1480 - 1488
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      • A. Venema , J.J.M. Dekkers , R.F. Humphryes . Static capacitance calculations for a surface acoustic wave interdigital transducer in multi-layered media. IEEE Trans.
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